Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy Assembly

A method comprising:

• providing a first substrate, a release layer attached to the first substrate, and a discrete component attached to the release layer;
• providing a device substrate and an adhesive layer attached to the device substrate;
• and
• applying a stimulus to the release layer, the stimulus causing the release layer to undergo a change in state at least partially concurrently with a change in state of the adhesive layer attached to the device substrate,
• in which the change in state of the release layer is a change to a state in which the release layer has an adhesion that is not sufficient to adhere the discrete component to the first substrate, and in which the change in state of the adhesive layer is a change to a state in which the adhesive layer has an adhesion that is sufficient to adhere the discrete component to the device substrate.

A method comprising:

• providing a substrate, a release layer attached to the substrate, and a discrete component releasably attached to the substrate by the release layer,
• in which the release layer comprises multiple layers, in which a first layer of the multiple layers is a permanent adhesive and a second layer of the multiple layers is at least one of thermally sensitive and UV light sensitive, and
• in which the discrete component has an ultra-thin, an ultra-small, or an ultra-thin and ultra-small configuration;
• and
• applying a stimulus to the release layer, the stimulus causing the release layer to release the discrete component such that, subsequent to being released from the release layer, the discrete component is in contact with neither the first layer nor the second layer.