Sample holder
AssigneeKYOCERA Corporation
InventorSeiya SAISHO
Life of this patent
Estimating the term…
Abstract
A sample holder according to the disclosure includes: for example, a plate-like ceramic substrate; a heat-generating resistor; a metallic member configured to cover another principal surface of the ceramic substrate; a bonding layer configured to bond the ceramic substrate and the metallic member; a lead terminal; a conduction section which is disposed inside the bonding layer and is configured to electrically connect the heat-generating resistor and the lead terminal; and a joining member configured to join the conduction section and the lead terminal. The joining member is covered with a low-thermal-conductivity member which is lower in thermal conductivity than the bonding layer.
Claims4
A sample holder, comprising:
- a ceramic substrate comprising one principal surface which serves as a sample holding face, and another principal surface;
- a heat-generating resistor disposed in an interior of the ceramic substrate or on the other principal surface of the ceramic substrate;
- a metallic member configured to cover the other principal surface of the ceramic substrate, the metallic member provided with a through hole which opens into one principal surface of the metallic member and another principal surface of the metallic member;
- a bonding layer configured to bond the other principal surface of the ceramic substrate to the one principal surface of the metallic member;
- a lead terminal inserted in the metallic member;
- a conduction section which is disposed inside the bonding layer and is configured to electrically connect the heat-generating resistor and the lead terminal, the conduction section comprising a region extending along the other principal surface of the ceramic substrate at a distance from the other principal surface of the ceramic substrate;
- a joining member formed of metal, the joining member configured to join the conduction section to the lead terminal;
- and
- a low-thermal-conductivity member configured to cover the joining member, the low-thermal-conductivity member being lower in thermal conductivity than the bonding layer.
Dependencies are inferred from the claim text.