Modular pressurized workstation

A method, comprising:

• interfacing first, second, third and fourth pressurized load ports with a workstation body;
• maintaining the workstation body at a set pressure level, wherein the workstation body comprises an internal material handling system configured to move a semiconductor workpiece within the workstation body between the first, second, third and fourth pressurized load ports at the set pressure level;
• processing a semiconductor wafer within a single chamber of a first modular tool, wherein the first modular tool is interfaced with the first and second pressurized load ports, and wherein the first pressurized load port is used for a first application and the second pressurized load port is used for a second application different from the first application;
• and
• processing the semiconductor wafer in a single chamber of a second modular tool after processing by the first modular tool, the second modular tool being interfaced with the third and fourth pressurized load ports, and wherein the third pressurized load port is used for a third application and the fourth pressurized load port is used for a fourth application different from the third application.