Substrate cleaning method, substrate cleaning system, and storage medium
AssigneeTokyo Electron Limited
InventorMeitoku AIBARA
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Abstract
A substrate cleaning method according to an aspect of the present disclosure includes: supplying a film-forming treatment liquid containing a volatile component to a substrate to form a film on the substrate; supplying a peeling treatment liquid, which peels off a treatment film from the substrate, to the treatment film formed by solidifying or curing the film-forming treatment liquid on the substrate due to volatilization of the volatile component; and supplying a hydrophobic liquid, which hydrophobizes the substrate, to the substrate to which the peeling treatment liquid has been supplied.
Claims12
A substrate cleaning method comprising:
- supplying a film-forming treatment liquid containing a volatile component to a substrate to form a film on the substrate;
- supplying a peeling treatment liquid, which peels off a treatment film from the substrate, to the treatment film formed by solidifying or curing the film-forming treatment liquid on the substrate due to volatilization of the volatile component;
- and
- supplying a hydrophobic liquid, which hydrophobizes the substrate, to the substrate to which the peeling treatment liquid has been supplied.
A substrate cleaning system comprising:
- a peeling treatment liquid supply part configured to supply a peeling treatment liquid, which peels off a treatment film from a substrate, to the treatment film formed by solidifying or curing a film-forming treatment liquid containing a volatile component on the substrate to which the film-forming treatment liquid is supplied, due to volatilization of the volatile component;
- and
- a hydrophobic liquid supply part configured to supply a hydrophobic liquid, which hydrophobizes the substrate, to the substrate to which the peeling treatment liquid has been supplied.
Dependencies are inferred from the claim text.