Substrate treating apparatus

A substrate treating apparatus for treating substrates, comprising:

• a substrate transport mechanism configured to transport a substrate;
• and
• a plurality of treating units each configured to perform a predetermined chemical treatment to the substrate transported by the substrate transport mechanism,
• the plurality of treating units being located side by side along a transportation path of the substrate transport mechanism, and being located so as to face each other across the transportation path and so as to be laminated in an up-down direction,
• the treating units each including:
• a treatment chamber as an area where a holding rotator configured to rotate the substrate while holding the substrate is provided, and the chemical treatment is performed to the substrate held and rotated by the holding rotator, and the substrate is delivered to and from the substrate transport mechanism via a substrate transportation port;
• a chemical piping portion as an area where a chemical pipe for supplying a chemical to the treatment chamber is located;
• and
• an exhaust chamber in communication with the treatment chamber via an exhaust port for exhausting gas from the treatment chamber, and also in communication with an exhaust pipe extending in the up-down direction, and
• all the treating units each being arranged such that the treatment chamber, the chemical piping portion, and the exhaust chamber are located side by side along the transportation path, and the chemical piping portion is located on a first side of the treatment chamber and the exhaust chamber faces the chemical piping portion across the treatment chamber when seen from the transportation path.