Substrate treatment device
AssigneeShibaura Mechatronics Corporation
InventorsKensuke DEMURA, Daisuke MATSUSHIMA, Masaya KAMIYA
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Abstract
According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand, and a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, forms a frozen film by freezing the liquid in the super cooled state, and causes crack to generate in the frozen film by decreasing a temperature of the frozen film.
Claims20
A substrate treatment device, comprising:
- a placement stand configured to rotate a substrate;
- a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate;
- a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand;
- and
- a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid, the controller setting the liquid on the surface of the substrate to be in a supercooled state, forming a frozen film by freezing the liquid in the super cooled state, and causing crack to generate in the frozen film by decreasing a temperature of the frozen film.
Dependencies are inferred from the claim text.