Method for manufacturing semiconductor wafer with wafer chuck having fluid guiding structure

A method for processing a semiconductor wafer, comprising:

• loading a semiconductor wafer on a top surface of a wafer chuck;
• supplying a gaseous material between the semiconductor wafer and the top surface of the wafer chuck through a gas inlet port of the wafer chuck;
• supplying a fluid medium to a fluid inlet port of the wafer chuck and guiding the fluid medium from the fluid inlet port to flow through a first arc-shaped channel and a second arc-shaped channel which are located at opposite sides of the gas inlet port, the second arc-shaped channel located closer to a center of the wafer chuck than the first arc-shaped channel, wherein the fluid medium from the fluid inlet port flows through the first arc-shaped channel prior to the second arc-shaped channel;
• and
• supplying a plasma gas over the semiconductor wafer.

A wafer fabricating system, comprising:

• a wafer chuck having a top surface, wherein a plurality of orifices are formed on the top surface;
• a gas inlet port formed in the wafer chuck and located underneath a fan-shaped sector of the top surface, wherein the gas inlet port is fluidly communicated with the orifices;
• a fluid inlet port formed in the wafer chuck;
• a first arc-shaped channel and a second arc-shaped channel fluidly communicated with the fluid inlet port, wherein the first arc-shaped channel and the second arc-shaped channel are located underneath the fan-shaped sector of the top surface and located at opposite sides of the gas inlet port;
• a gas source fluidly connected to the gas inlet port;
• and
• a fluid containing source fluidly connected to the fluid inlet port.