Reconditioning of reactive process chamber components for reduced surface oxidation

A method of operating an etch process chamber, the method comprising:

• positioning a first workpiece adjacent to an edge ring within the chamber, the edge ring comprising a predominantly aluminum bulk and a surface oxide upon the bulk, wherein the surface oxide comprises less aluminum than oxygen;
• performing an etch process on the first workpiece within the chamber, the etch process forming a residue comprising one or more chemical byproducts of the etch process upon edge ring;
• removing the edge ring from the chamber;
• receiving the edge ring subsequent to a refurbishment, the edge ring substantially free of the residue, and comprising the predominantly aluminum bulk and a surface oxide comprising less aluminum than oxygen;
• returning the edge ring to the chamber;
• and
• performing an etch process on a second workpiece.

A process chamber component reconditioning system, comprising:

• an enclosure within which at least a portion of a surface of a reactive process chamber component is to be exposed to a media propelled with a gaseous propellant;
• a supply of the gaseous propellant, the supply coupled to an inlet of the enclosure, wherein the supply of the gaseous propellant comprises a smaller fraction of O2 than air;
• and
• one or more vessels to contain a chemical bath to at least partially remove oxygen from at least the portion of the surface.