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US 2021/0265114 A1Published application
Multilayer electronic component and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsJin Soo PARK, Myung Jun PARK, Hyun Hee GU, Bum Soo KIM, Yeon Song KANG, Duk Hyun CHUN, Chung Eun LEE
Life of this patent
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Abstract
A multilayer electronic component, in which the external electrode may be thinned to secure capacitance per unit volume, while securing the external electrode at a corner in a specific thickness or higher with improved reliability for moisture resistance.
Claims20
A multilayer electronic component comprising:
- a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed in a first direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction;
- and
- a first external electrode including a first electrode layer disposed on one of the third and fourth surfaces, a second electrode layer disposed on the first electrode layer, a third electrode layer disposed on the first and second surfaces, and a fourth electrode layer disposed on the second electrode layer and extending onto a portion of the third electrode layer.
A method for manufacturing a multilayer electronic component, the method comprising:
- forming a body including a dielectric layer, and a first internal electrode and a second internal electrode alternately disposed in a first direction with the dielectric layer interposed therebetween, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first to fourth surfaces and opposing each other in a third direction;
- forming, by a transfer process, a first electrode layer on one of the third and fourth surfaces and a second electrode layer on the first electrode layer;
- forming, by a first dipping process, a third electrode layer on the first surface, the second surface, and the one of the third and fourth surfaces to cover the second electrode layer and portions of the first and second surfaces;
- removing a portion of the third electrode layer formed on the one of the third and fourth surfaces;
- and
- forming, by a second dipping process, a fourth electrode layer to cover a remaining portion of the third electrode layer and to cover the second electrode layer.
3 more elements
Dependencies are inferred from the claim text.