Semiconductor package test method, semiconductor package test device and semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsHyungsuk Yu, Hyukje Kwon, Jisoo Choi
Life of this patent
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Abstract
A method of testing a semiconductor package including a plurality of semiconductor chips includes sensing electrical signals respectively output from a plurality of semiconductor chip groups each representing a combination of at least two semiconductor chips among the plurality of semiconductor chips, obtaining amplitudes of electrical signals respectively output from the plurality of semiconductor chips based on the plurality of sensed electrical signals, and outputting a test result for the semiconductor package by using the plurality of obtained electrical signals.
Claims22
A method of testing a semiconductor package including a plurality of semiconductor chips, the method comprising:
- sensing a plurality of electrical signals respectively output from a plurality of semiconductor chip groups, each of the plurality of semiconductor chip groups representing a combination of at least two semiconductor chips among the plurality of semiconductor chips;
- obtaining amplitudes of a plurality of electrical signals respectively output from the plurality of semiconductor chips based on the plurality of sensed electrical signals;
- and
- outputting a test result for the semiconductor package by using the plurality of obtained electrical signals.
A method of testing a semiconductor package including a plurality of semiconductor chips, the method comprising:
- sensing a plurality of electrical signals respectively output from a plurality of semiconductor chip groups, each of the plurality of semiconductor chip groups representing a combination of at least two semiconductor chips among the plurality of semiconductor chips;
- comparing the plurality of sensed electrical signals with a reference table including reference values corresponding to a plurality of semiconductor chip combinations;
- and
- outputting a test result for the semiconductor package based on a comparison result of the comparing of the plurality of sensed electrical signals with the reference table.
-20. (canceled)
A semiconductor package comprising:
- a plurality of semiconductor chips sharing one channel;
- and
- a control circuit configured to receive a Chip Enable Reduction (CER) command to simultaneously select at least two semiconductor chips, receive a plurality of address signal corresponding to semiconductor chips from the plurality of semiconductor chips, and control the semiconductor chips in response to the CER command, where the CER command is received from the outside of the semiconductor package,
- wherein the semiconductor package is configured to output a sum of currents output from the selected semiconductor chips through the one channel.
-31. (canceled)
Dependencies are inferred from the claim text.