Systems and methods for managing thermal dissipation in multi-stacked dies

A method for managing thermal dissipation in multi-stacked memory dies, the method comprising:

• maintaining, by a processing component, memory block states for a first plurality of memory blocks, wherein the processing component is coupled to a first plurality of memory dies in a stacked configuration, wherein the first plurality of memory dies comprises the first plurality of memory blocks to store data, and wherein the memory block states comprise:
• an open memory block state allowing write operations;
• and
• a closed memory block state preventing write operations;
• receiving, by the processing component, a first write command to store first data;
• computing, by the processing component, first relative distances between a first plurality of open memory blocks, wherein the first plurality of open memory blocks are in the open memory block state, and wherein the first plurality of memory dies comprises the first plurality of open memory blocks;
• selecting, by the processing component, a first set of open memory blocks for a first write operation, wherein the first write operation is for storing the first data, wherein the first set of open memory blocks is selected from the first plurality of open memory blocks, and wherein the first set of open memory blocks is selected based on the first relative distances so as to manage thermal dissipation;
• and
• initiating, by the processing component, the first write operation on the first set of open memory blocks.

One or more non-transitory computer-readable storage media comprising instructions, which when executed by a processing component, cause the processing component to:

• maintain memory block states for a first plurality of memory blocks, wherein the processing component is coupled to a first plurality of memory dies in a stacked configuration, wherein the first plurality of memory dies comprises the first plurality of memory blocks to store data, and wherein the memory block states comprise:
• an open memory block state allowing write operations;
• and
• a closed memory block state preventing write operations;
• receive a first write command to store first data;
• compute first relative distances between a first plurality of open memory blocks, wherein the first plurality of open memory blocks are in the open memory block state, and wherein the first plurality of memory dies comprises the first plurality of open memory blocks;
• select a first set of open memory blocks for a first write operation, wherein the first write operation is for storing the first data, wherein the first set of open memory blocks is selected from the first plurality of open memory blocks, and wherein the first set of open memory blocks is selected based on the first relative distances so as to manage thermal dissipation;
• and
• initiate the first write operation on the first set of open memory blocks.