Package structure

A package structure, comprising:

• a circuit board comprising an optical waveguide;
• a first fanout package disposed over the circuit board, the first fanout package comprising a first insulating encapsulant and first integrated circuit dies encapsulated by the first insulating encapsulant, wherein a first surface of the first insulating encapsulant is substantially leveled with first active sides of the first integrated circuit dies, and the first integrated circuit dies are spaced apart from each other by the first insulating encapsulant;
• and
• a second fanout package disposed over the circuit board, the second fanout package comprising a second insulating encapsulant and second integrated circuit dies encapsulated by the second insulating encapsulant, wherein the first fanout package is optically coupled to the second fanout package through the optical waveguide of the circuit board.

A package structure, comprising:

• a circuit board comprising an optical waveguide;
• a first fanout package disposed over the circuit board, the first fanout package comprising a first photoelectric integrated circuit die and a first insulating encapsulant, the first photoelectric integrated circuit die being optically coupled to the optical waveguide of the circuit board, and the first photoelectric integrated circuit die being in contact with the first insulating encapsulant;
• and
• a second fanout package disposed over the circuit board, the second fanout package comprising a second photoelectric integrated circuit die optically coupled to the optical waveguide of the circuit board.