Sonic wave sensor unit, and recording device
AssigneeSeiko Epson Corporation
InventorsShinya YAMAZAKI, Osamu MURAYAMA
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AssigneeSeiko Epson Corporation
InventorsShinya YAMAZAKI, Osamu MURAYAMA
Estimating the term…
A sonic wave sensor unit includes an element substrate having a transmitting element having a transmission side piezoelectric element and transmitting a sonic wave to a medium, and a receiving element having a reception side piezoelectric element and a reception side vibrating surface and receiving a sonic wave reflected by the medium, a sonic wave sensor including a sealing substrate configured to seal the transmission side piezoelectric element and the reception side piezoelectric element, and a holder disposed on a side opposite to the element substrate with respect to the sealing substrate in a −Z direction and fixed to the sealing substrate, wherein a through hole penetrating the holder in the −Z direction is formed in the holder, and, in plan view viewed in the −Z direction, the reception side vibrating surface is disposed inside a wall surface of the holder constituting the through hole.
A sonic wave sensor unit, comprising:
Dependencies are inferred from the claim text.