Back to results
US 2021/0262109 A1Published application
Substrate holding apparatus
AssigneeEbara Corporation
InventorsTakahiro Abe, Takuya Tsushima, Tomonori Hirao
Life of this patent
Estimating the term…
Loading patent…
Loading patent…
AssigneeEbara Corporation
InventorsTakahiro Abe, Takuya Tsushima, Tomonori Hirao
Estimating the term…
Provided is a substrate holding apparatus capable of appropnately holding a substrate. The substrate holding apparatus is suggested to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated. The substrate holding apparatus comprises a grasp module to come in contact with the edge portion of the substrate and thereby grasp the substrate, a suction module to attract the portion to be plated of the substrate by suction to hold the portion to be plated, and a protrusion provided at a position corresponding to the portion to be plated in the substrate, and protruding toward the substrate to be held by the substrate holding apparatus more than the suction module.
A substrate holding apparatus to hold a substrate including a portion to be plated that is exposed to a plating solution and an edge portion that is an area outside the portion to be plated, the substrate holding apparatus comprising:
A substrate holding apparatus to hold a substrate, comprising:
Dependencies are inferred from the claim text.