US 2021/0261735 A1 · Heat Resistant Polyimide Film

Abstract

A high temperature resistant polyimide film and its preparation method. The present invention relates to a polyimide film and its preparation method and solves the problems of honeycomb's and skin panel's core adhesive—polyimide film with insufficient heat resistance, no climbing of bonding core structure and adhesive fillet formation. The high temperature resistant polyimide film is made by polyimide solution, inorganic filler modifier and interface coupling agent by the steps of: under specific temperature and stirring conditions, adding inorganic filler modifier and interface coupling agent to polyimide solution, stirring to obtain the adhesive agent; filtering and degassing the adhesive agent, casting to a stainless steel drum with carrier cloth and release paper to obtain a self-supporting film; then heating and annealing to obtain the final polyimide film. The present invention is applied to high temperature resistant polyimide film and its preparation method.

Claims5

Dependent claims

A resistant polyimide film, characterized in that:

the polyimide film is manufactured by:
100 parts by weight of polyimide solution;
10 parts to 40 parts by weight of inorganic filler modifier;
and 0.1 parts ˜5 parts by weight of interface coupling agent,
wherein the inorganic filler modifier consists of silicon dioxide (silica)-based substance and substance for increasing interface bonding, and the mass ratio of the silica-based substance and the substance for increasing interface bonding is 1:(0.1˜0.5),
the silica-based substance is hollow ceramic microspheres, fumed silica (silicon dioxide in gaseous state), fused silica (melted silicon dioxide) or amorphous silica,
the substance for increasing interface bonding is one or a mixture of two or more selected from the group consisting of:
aluminum hydroxide, magnesium hydroxide, molybdenum oxide, aluminum nitride, aluminum oxide, boron nitride and silicon carbide,
the polyimide solution comprises polyimide which has a structural formula of:
where n is 1-19;
wherein Ar1 has a structural formula of:
wherein Ar2 has a structural formula of:

9 more elements

Dependencies are inferred from the claim text.

Heat Resistant Polyimide Film

Life of this patent

Heat Resistant Polyimide Film

Life of this patent

Abstract

Claims5