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US 2021/0260853 A1Published application
Electronic component and method of manufacturing electronic component
AssigneeMitsubishi Materials Corporation
InventorsMasayuki Ishikawa, Satoru Daido, Kaoru Nishizawa, Akihiro Yoshida, Hiroki Sato
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Abstract
An electronic component includes a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au—Sn alloy layer formed on at least one of the glass-containing Au layers; the electronic component further includes a pure-Au layer between the glass-containing Au layer and the Au—Sn alloy layer; furthermore, the Au—Sn alloy layer has an Au—Sn eutectic structure.
Claims5
An electronic component comprising
- a ceramic element,
- glass-containing Au layers formed on both surfaces of the ceramic element, and
- an Au—Sn alloy layer formed on at least one of the glass-containing Au layers.
4-8. (canceled)
Dependencies are inferred from the claim text.