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US 2021/0260719 A1Published application
Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device
AssigneeToshiba Memory Corporation
InventorsTakahiko KAWASAKI, Yukiteru MATSUI, Akifumi GAWASE
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Abstract
A polishing pad is described. The polishing pad includes a surface having plural recess portions, and a substrate is polished by the surface. In the pad, an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 μm or less, and an average density of the recess portions at one area of the surface is 1,300/mm2 or more.
Claims17
A method of fabricating a semiconductor device, comprising:
- holding, by a polishing table, a polishing pad which includes a surface having plural recess portions, wherein an average width of the recess portions at one area of the surface in a direction parallel to the surface is 20 μm or less, and an average density of the recess portions at one area of the surface is 1,300/mm2 or more;
- supplying a polishing liquid to the surface of the polishing pad;
- and
- polishing a substrate using the surface of the polishing pad.
1 more element
A method of fabricating a semiconductor device, comprising:
- dressing a surface of a polishing pad;
- holding the dressed polishing pad on a polishing table, wherein the dressed polishing pad includes a surface having plural recess portions, wherein an average width of the recess portions in a direction parallel to the surface is 20 μm or less, and an average density of the recess portions at one area of the surface is 1,300/mm2 or more;
- supplying a slurry to the surface of the dressed polishing pad;
- and
- polishing a substrate with the slurry between the surface of the dressed polishing pad and the substrate.
2 more elements
Dependencies are inferred from the claim text.