Chemical mechanical planarization equipment, wafer transfer method, and wafer planarization unit
AssigneeHangzhou Sizone Electronic Technology Inc.
InventorsEdwardLiCang LEE, Jingran GU
Life of this patent
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Abstract
A chemical-mechanical planarization equipment, comprising a polishing module, a cleaning module and a wafer transfer module, wherein the polishing module comprises two rows of polishing unit arrays, each row of polishing unit arrays comprises two or more sets of polishing units, polishing transfer stations corresponding to two rows of polishing unit arrays are longitudinally arranged and located in the row direction of the polishing unit arrays, and a working area of the wafer transfer module is located vertically above the longitudinally arranged polishing transfer stations.
Claims22
A chemical-mechanical planarization equipment, comprising a polishing module, cleaning modules, and a wafer transfer module, wherein the cleaning modules are used for cleaning polished wafers, characterized in that, the polishing module includes two rows of polishing unit arrays, each containing two or more sets of polishing units;
- polishing transfer stations corresponding to the two rows of polishing unit arrays are longitudinally arranged in a row direction of the polishing unit arrays;
- the cleaning modules are arranged in two rows, corresponding to the two rows of polishing unit arrays;
- a working area of the wafer transfer module, is located vertically above the polishing transfer stations that are longitudinally arranged, and performs wafer transfer among other loading and unloading area and the polishing transfer stations, and between the polishing transfer stations.
A wafer planarization unit, comprising a polishing platform frame, a polishing platform located above the polishing platform frame, a platen installed on the polishing platform, a polishing swing arm which drives a polishing head to swing on the platen, a polishing liquid spray arm, a conditioner swing arm, a wafer transfer station frame, and a wafer transfer station above the wafer transfer station frame;
- wherein the wafer transfer station frame and the wafer transfer station are located outside a cover of the planarization unit, and the remaining components are all located inside the cover;
- a movable door is provided on the cover of the planarization unit, and the polishing swing arm drives the polishing head to pass through the movable door to a location above the wafer transfer station for wafer loading and unloading.
Dependencies are inferred from the claim text.