Chip-type fuse with a metal wire type fusible element and manufacturing method for the same
AssigneeConquer Electronics Co., Ltd.
InventorsHung-Chih CHIU, Po-Shuo CHIU
Life of this patent
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AssigneeConquer Electronics Co., Ltd.
InventorsHung-Chih CHIU, Po-Shuo CHIU
Estimating the term…
A chip-type fuse has a substrate. Two pads are disposed over a first side of the substrate. At least one fusible element is disposed over the first side of the substrate and electrically connects to the pads. A protective layer covers the first side of the substrate and the fusible element. The fusible element has a cross-section that is substantially circular, so the time durations for heat conduction from the center to points on the radial edge at the cross-section of the fusible element are almost equal. Thus, the fusible element can be uniformly heated. Therefore, when the circuit is overheated, the blow of the fusible element is uniform, which may effectively interrupt the circuit and protect the circuit.
A chip-type fuse, comprising:
A method of manufacturing a chip-type fuse, comprising steps of:
Dependencies are inferred from the claim text.