Method for manufacturing a timepiece component and component obtained by this method

A method for manufacturing a timepiece component comprising the following steps:

• a) taking a substrate, depositing a first electrically conductive layer thereon, and applying a first photoresist layer;
• b) irradiating the first photoresist layer through a mask defining a first level of the component and dissolving a non-irradiated areas of the photoresist layer to reveal in places the first electrically conductive layer and to form a photopolymerised photoresist mould defining the first level of the component;
• c) locally depositing a second electrically conductive layer on the photopolymerised photoresist of the first photoresist layer, the second electrically conductive layer being deposited through a stencil mask or by printing an ink or a conductive resin;
• d) applying a second photoresist layer covering the structure produced in step c);
• e) irradiating the second photoresist layer through a mask defining a second level of the component and dissolving the non-irradiated areas of the second photoresist layer to form a mould comprising a first and a second level and to reveal in places the first and the second electrically conductive layer;
• f) depositing a metal layer by electroforming in the mould from the first layer and second layer to form the component, the layer substantially reaching the top surface of the second photoresist layer;
• g) machining, using a mechanical method, the metal layer to a predefined thickness;
• h) producing, in wafer form and by mechanical machining, additional shapes on the top face of the component;
• and
• i) successively removing the substrate, the conductive layers and the photoresist to release the component.