Treatment process for recycling silicon ingot cutting waste
AssigneeRosi
InventorYun Luo
Life of this patent
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Abstract
A treatment method for purifying silicon microparticles contained in waste resulting from the cutting of ingots with a diamond wire comprises: a) providing a contaminated slurry, resulting from the waste, formed by an aqueous mixture comprising the silicon microparticles, organic species and metal contaminants; b) adding a dilute hydrogen peroxide solution to the contaminated slurry, in order to form a first mixture, and stirring the first mixture; c) solid/liquid separation of the first mixture in order to obtain, on the one hand, a first purified slurry and, on the other hand, a first liquid loaded with organic species and metal contaminants.
Claims18
A treatment method for purifying silicon microparticles contained in waste resulting from cutting ingots with diamond wires, the method comprising:
- a) providing a contaminated slurry, resulting from the waste, comprising an aqueous mixture including the silicon microparticles, organic species and metal contaminants;
- b) adding a dilute hydrogen peroxide solution to the contaminated slurry to form a first mixture comprising the contaminated slurry, hydrogen peroxide and water, and stirring the first mixture;
- and
- c) performing solid/liquid separation of the first mixture in order to obtain a first purified slurry and a first liquid loaded with organic species and metal contaminants.
Dependencies are inferred from the claim text.