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US 2021/0247218 A1Published application
Systems And Methods To Increase Sensor Robustness
AssigneeHutchinson Technology Incorporated
InventorsClark T. Olsen, Michael W. Davis, Douglas P. Riemer, Matthew S. Lang
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Abstract
An apparatus is described. The apparatus including a substrate; one or more sensors and one or more electrical circuits formed on the substrate, the one or more electrical circuits electrically coupled with at least one of the one or more sensors; and a metal layer formed over the sensors, wherein the metal layer is positioned over the one or more sensors to provide a barrier.
Claims26
An apparatus comprising:
- a substrate;
- a first metal layer disposed on the substrate, the first metal layer including one or more sensors formed in the first metal layer;
- a second metal layer disposed over the first metal layer, the second metal layer including one or more electrical circuits electrically coupled with at least one of the one or more sensors formed in the first metal layer;
- and
- the second metal layer is positioned over the first metal layer and configured to provide a physical barrier covering the one or more sensors.
2 more elements
A sensor comprising:
- a substrate;
- a dielectric layer disposed on the substrate;
- a metal layer disposed on the dielectric layer, the metal layer including one or more sensor components formed in the metal layer;
- and
- a border feature disposed around the one or more sensor components.
2 more elements
A method for increasing sensor robustness comprising;
- forming a first metal layer on a substrate;
- forming one or more sensors in the first metal layer;
- and
- forming a second metal layer over the first metal layer, the second metal layer positioned over the one or more sensors to form a barrier that prevents moisture or oxygen from penetrating onto the one or more sensors.
1 more element
An apparatus comprising:
- a substrate;
- a first metal layer disposed on the substrate, the first metal layer including one or more electrical circuits;
- a second metal layer disposed over the first metal layer, the second metal layer including at least one of the one or more sensors;
- a first insulating layer disposed between the first metal layer and the second metal layer;
- and
- a third metal layer is disposed over the second metal layer and configured to provide a physical barrier covering the one or more sensors.
3 more elements
Dependencies are inferred from the claim text.