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US 2021/0247178 A1Published application
Tool architecture for wafer geometry measurement in semiconductor industry
AssigneeNanjing LiAn Semiconductor Limited
InventorAn Andrew ZENG
Life of this patent
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Abstract
A semiconductor equipment architecture WGT for wafer shape and flatness measurement is disclosed. The semiconductor equipment architecture WGT includes a reflective air-bearing chuck and a hybrid wafer thickness gauge. Also disclosed are the corresponding methods of measuring wafer shape and flatness using the architecture, the air-bearing chuck and the hybrid wafer thickness gauge.
Claims21
1-10. (canceled)
An air-bearing chuck comprising:
- an array of pressure nozzles;
- an array of vacuum nozzles;
- and
- wherein the array of pressure nozzles and array of vacuum nozzles are in an axis symmetric and alternating arrangement, the arrangement forming a plurality of concentric rings.
1 more element
Dependencies are inferred from the claim text.