Resin composition, heat storage material, and article
AssigneeShowa Denko Materials Co., Ltd.
InventorsNaoki FURUKAWA, Tsuyoshi MORIMOTO, Atsuko SANO, Hiroshi YOKOTA, Nozomi MATSUBARA, Akira NAGAI, Keiko KIZAWA
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Abstract
An aspect of the present invention is a resin composition containing an acrylic resin obtained by polymerizing a monomer component including: a first monomer represented by formula (1); and a second monomer copolymerizable with the first monomer and having a reactive group. [In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents a group having a polyoxyalkylene chain.]
Claims18
A resin composition comprising an acrylic resin obtained by polymerizing monomer components including a first monomer represented by the following Formula (1) and a second monomer copolymerizable with the first monomer and having a reactive group:
- in the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents a group having a polyoxyalkylene chain.
A resin composition comprising an acrylic resin including a first structural unit represented by the following Formula (2) and a second structural unit having a reactive group:
- in the formula, R3 represents a hydrogen atom or a methyl group, and R4 represents a group having a polyoxyalkylene chain.
Dependencies are inferred from the claim text.