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US 2021/0246334 A1Published application
Polishing composition, method for producing polishing composition, polishing method, and method for producing semiconductor substrate
AssigneeFujimi Incorporated
InventorTzu-Chun TSENG
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Abstract
A polishing composition according to the present invention includes: silica; an anionic water-soluble polymer; at least one compound selected from the group consisting of a phosphonate group-containing compound, a phosphate group-containing compound, and an amino group-containing compound; and a dispersing medium.
Claims14
-12. (canceled)
A polishing composition comprising:
- silica;
- an anionic water-soluble polymer;
- at least one compound selected from the group consisting of a phosphonate group-containing compound, a phosphate group-containing compound, and an amino group-containing compound;
- and
- a dispersing medium,
- wherein an anionic group of the anionic water-soluble polymer is selected from the group consisting of a carboxylic group (carboxyl group), a sulfonic group, a sulfuric acid ester group, a phosphoric acid ester group, and a phosphonate group, and a content of the anionic water-soluble polymer is 1600 ppm or more.
3 more elements
Dependencies are inferred from the claim text.