Method and device for processing a workpiece
AssigneeTRUMPF Werkzeugmaschinen GmbH + Co. KG
InventorsManuel Kiefer, Christoph Bloemker, Uwe Mienhardt, Jens Ottnad, Leonie Felica Tatzel, Korbinian Weiss
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Abstract
A method for processing a workpiece with a laser cutting machine includes reading out a machine parameter and a material parameter and outputting a process parameter recommendation. The process parameter recommendation is created by a process parameter algorithm with at least one data aggregation routine based on a plurality of cut edge quality features. The method further includes generating a cut edge by laser processing the workpiece.
Claims14
A method for processing a workpiece with a laser cutting machine, the method comprising:
- A) reading out a machine parameter and a material parameter;
- B) outputting a process parameter recommendation, the process parameter recommendation being created by a process parameter algorithm with at least one data aggregation routine based on a plurality of cut edge quality features;
- and
- C) generating a cut edge by laser processing the workpiece.
A device for processing a workpiece, the device comprising:
- a) an input unit configured to input at least one machine parameter and at least one material parameter;
- b) a computing unit configured to execute a process parameter algorithm configured to output a process parameter recommendation, the process parameter algorithm having at least one data aggregation routine which is based on a plurality of cut edge quality features;
- and
- c) a laser cutting machine configured to perform laser processing of the workpiece.
Dependencies are inferred from the claim text.