# US 2021/0243903 A1 · Ultra thin dielectric printed circuit boards with thin laminates and method of manufacturing thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0243903 A1 - Document ID: US20210243903A1 - Status: Published application - Kind: A1 - Application number: 17/234,471 - Filed: 2021-04-19 - Published: 2021-08-05 - Earliest claimed: 2017-07-15 - Assignees: Sanmina Corporation - Applicants: Sanmina Corporation - Inventors: Shinichi Iketani; Toshiya Suzuki - Web page: https://patentgrep.com/patent/US20210243903A1 ## CPC - H05K 3/4655: {by using a laminate characterized by the insulating layer (general-purpose insulating materials H05K1/03, H05K3/4673)} - H05K 1/119: {Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence)} - H05K 3/007: {Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence)} - H05K 3/0097: {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)} - H05K 3/4673: {Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer (similar methods for protective coatings H05K3/28)} - H05K 3/4682: {Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil} - H05K 3/02: in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding - H05K 3/4664: {Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders (H05K3/4647 takes precedence)} - H05K 2201/0191: wherein the thickness of the dielectric plays an important role - H05K 2203/013: Inkjet printing, e.g. for printing insulating material or resist - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Ultra-thin dielectric printed circuit boards (PCBs) are provided. An ultra-thin dielectric layer may be coupled to a first conductive layer on a first side of the ultra-thin dielectric layer. A second conductive layer may be coupled to a second side of the ultra-thin dielectric layer, and the ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may be patterned to form electrical paths. The patterned second conductive layer may be filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may also be coupled to the second conductive layer. ## Claims ### Claim 1 An ultra-thin dielectric printed circuit board (PCB), comprising: an ultra-thin dielectric layer; a first conductive layer coupled to a first side of the ultra-thin dielectric layer; and a second conductive layer coupled to a second side of the ultra-thin dielectric layer, wherein the ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. ### Claim 2 (depends on 1) The ultra-thin dielectric printed circuit board of claim 1, wherein the ultra-thin dielectric layer is thinner than both the first conductive layer and the second conductive layer. ### Claim 3 (depends on 1) The ultra-thin dielectric printed circuit board of claim 1, wherein the ultra-thin dielectric layer has thickness of 50 micron or less, while the first and second conductive layers are each more than 50 micron thick. ### Claim 4 (depends on 1) The ultra-thin dielectric printed circuit board of claim 1, wherein the ultra-thin dielectric layer has thickness of 20 micron or less, while the first and second conductive layers are each more than 20 micron thick. ### Claim 5 (depends on 1) The ultra-thin dielectric printed circuit board of claim 1, wherein the ultra-thin dielectric layer has thickness of 10 micron or less, while the first and second conductive layers are each more than 10 micron thick. ### Claim 6 (depends on 1) The ultra-thin dielectric printed circuit board of claim 1, further comprising: conductive patterns on at least one of the first and second conductive layers, wherein the at least one of the first and second patterned conductive layers are filled with a cured dielectric filler and planarized. ### Claim 7 An ultra-thin dielectric printed circuit board (PCB), comprising: a first conductive layer removably coupled on a first side to a disposable base; a patterned second conductive layer; a first ultra-thin dielectric layer coupled to a second side of the first conductive layer and to the second conductive layer, where the first ultra-thin dielectric layer is positioned between and in direct contact with the first conductive layer and the second conductive layer across the entirety of the first conductive layer and the second conductive layer, and the first ultra-thin dielectric layer is thinner than the first conductive layer and the second conductive layer an ultra-thin dielectric layer; a dielectric filler filling the patterned second conductive layer. ### Claim 8 (depends on 7) The ultra-thin dielectric printed circuit board of claim 7, further comprising: at least one additional conductive layer and at least one additional ultra-thin dielectric layer coupled to the second conductive layer. ### Claim 9 (depends on 7) The ultra-thin dielectric printed circuit board of claim 7, wherein the one or more ultra-thin dielectric layers are thinner than at least one adjacent conductive layer. ### Claim 10 (depends on 7) The ultra-thin dielectric printed circuit board of claim 7, wherein all ultra-thin dielectric layers are thinner than at least one adjacent conductive layer. ### Claim 11 (depends on 7) The ultra-thin dielectric printed circuit board of claim 7, wherein each ultra-thin dielectric layer has thickness of 50 micron or less while the first and second conductive layers are each more than 50 micron thick. ### Claim 12 (depends on 7) The ultra-thin dielectric printed circuit board of claim 7, wherein each ultra-thin dielectric layer has thickness of 20 micron or less while the first and second conductive layers are each more than 20 micron thick. ### Claim 13 (depends on 7) The ultra-thin dielectric printed circuit board of claim 7, wherein each ultra-thin dielectric layer has thickness of 10 micron or less while the first and second conductive layers are each more than 10 micron thick. ### Claim 14 (depends on 7) The ultra-thin dielectric printed circuit board of claim 7, wherein the first and second conductive layers each have a thickness of 3 micron, 5 micron, 9 micron, 12 micron, 0.5 ounce copper, 1 ounce copper, or 2 ounce copper. ### Claim 15 (depends on 7) The ultra-thin dielectric printed circuit board of claim 7, wherein the first conductive layer is patterned, and the first conductive layer, the first ultra-thin dielectric layer, and the second conductive layer comprise at least a portion of a first subassembly structure, and further comprising: a patterned outer conductive layer coupled to the first subassembly structure, opposite the first conductive layer, to form a first subassembly core; and the patterned first conductive layer of the first subassembly structure is coupled to a second subassembly core after removal of the disposable base from the first conductive layer.