# US 2021/0243898 A1 · Method for manufacturing an electromechanical structure and an arrangement for carrying out the method

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- Number: US 2021/0243898 A1
- Document ID: US20210243898A1
- Status: Published application
- Kind: A1
- Application number: 17/215,001
- Filed: 2021-03-29
- Published: 2021-08-05
- Earliest claimed: 2013-09-27
- Assignees: Tactotek Oy
- Applicants: TactoTek Oy
- Inventors: Mikko Heikkinen; Jarmo Sääski; Jarkko Torvinen; Paavo Niskala; Mikko Sippari; Pasi Raappana; Antti Keränen
- Web page: https://patentgrep.com/patent/US20210243898A1

## CPC

- H05K 3/0014: {Shaping of the substrate, e.g. by moulding}
- B29C 45/1418: {the inserts being deformed or preformed, e.g. by the injection pressure}
- B29C 45/14639: {for obtaining an insulating effect, e.g. for electrical components}
- B29C 45/14819: {the inserts being completely encapsulated}
- H05K 1/0284: {Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014)}
- H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)}
- B29C 45/14811: {Multilayered articles (B29C45/14827 takes precedence)}
- B29C 2045/14237: {the inserts being deformed or preformed outside the mould or mould cavity}
- B29L 2031/3425: {Printed circuits}
- B29L 2031/3481: {Housings or casings incorporating or embedding electric or electronic elements}
- H05K 2201/0129: Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
- H05K 2201/09118: Moulded substrate
- H05K 2203/1105: Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES

## Abstract

A method for manufacturing an electromechanical structure, including producing conductors on a flat film; estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film; attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations; forming the flat film into the three-dimensional film; and injection molding material on the three-dimensional film.

## Claims

### Claim 1

A method for manufacturing an electromechanical structure, comprising:
producing conductors on a flat film;
estimating a strain a plurality of locations of the flat film will undergo during formation thereof into a three-dimensional film;
attaching electronic elements on the flat film at selected locations of the plurality of locations of the flat film, wherein the estimated strain of the selected locations of the plurality of locations is less than the estimated strain in other locations of the plurality of locations;
forming the flat film into the three-dimensional film.

### Claim 2 (depends on 1)

The method of claim 1, wherein the flat film is a substrate.

### Claim 3 (depends on 2)

The method of claim 2, wherein the substrate is a printed circuit board (PCB) or a printed wiring board (PWB).

### Claim 4 (depends on 1)

The method of claim 1, wherein the flat film is flexible.

### Claim 5 (depends on 1)

The method of claim 1, wherein the flat film comprises at least one of polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polycarbonate (PC), acrylonitrile-butadiene-styrene (ABS), Glycolized polyethylene terephthalate (PETG), high impact polystyrene (HIPS), high-density polyethylene (HDPE), acrylic polymer, or a mixture of these.

### Claim 6 (depends on 1)

The method of claim 1, wherein producing the conductors on the flat film includes printing by a printing technique chosen from at least one of screen printing, rotary screen printing, gravure printing, flexography, jet printing, tampo printing, etching, transfer laminating, or thin-film deposition.

### Claim 7 (depends on 1)

The method of claim 1, wherein the attached electronic elements further include through-hole, flip-chip, or printed entities.

### Claim 8 (depends on 1)

The method of claim 1, wherein attaching the electronic elements on the flat film includes printing the electronic elements on the flat film.

### Claim 9 (depends on 1)

The method of claim 1, wherein the electronic elements are produced by printing on a substrate which is subsequently attached to the flat film.

### Claim 10 (depends on 1)

The method of claim 1, wherein attaching the electronic elements includes flexibly attaching the electronic elements by anchoring, gluing, or other adhesive.

### Claim 11 (depends on 1)

The method of claim 1, wherein producing the conductors on the flat film and attaching the electronic elements on the flat film are carried out by a continuous roll-to-roll process or a reel-to-reel process.

### Claim 12 (depends on 1)

The method of claim 1, wherein forming the flat film into the three-dimensional film is achieved by a thermoforming process including at least one of vacuum forming, pressure forming, billow forming, drape forming, blow molding, pre molding, rotational molding, or a combination of these.

### Claim 13 (depends on 1)

The method of claim 1, further comprising coating the electromechanical structure.