# US 2021/0243897 A1 · Electrically Functional Circuit Board Core Material > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0243897 A1 - Document ID: US20210243897A1 - Status: Published application - Kind: A1 - Application number: 17/163,648 - Filed: 2021-02-01 - Published: 2021-08-05 - Earliest claimed: 2020-02-04 - Assignees: Kemet Electronics Corporation - Applicants: KEMET Electronics Corporation - Inventors: Brandon Summey; Peter A. Blais; Robert Andrew Ramsbottom; Jeffrey Poltorak; Courtney Elliott - Web page: https://patentgrep.com/patent/US20210243897A1 ## CPC - H05K 1/185: associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards - H05K 1/188: {manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component} - H01G 9/045: based on aluminium - H01G 9/048: characterised by their structure (H01G11/22 takes precedence) - H05K 1/0393: {Flexible materials (H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups)} - H05K 3/30: Assembling printed circuits with electric components, e.g. with resistors - H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)} - H01G 4/33: Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} - H01G 9/0425: {specially adapted for cathode} - H05K 3/022: {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} - H05K 3/4602: {characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated} - H05K 2201/10015: Non-printed capacitor - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) ## Abstract An improved circuit board core material, and method of making the circuit board core material, is provided wherein the circuit board core material is particularly suitable for use in a circuit board. The circuit board core material comprises a laminate. The laminate comprises a prepreg layer with a first clad layer on the prepreg layer wherein the prepreg layer comprises a pocket. An electronic component is in the pocket wherein the electronic component comprises a first external termination and a second external termination. The first external termination is laminated to, and in electrical contact with, the first clad layer and said second external termination is in electrical contact with a conductor. ## Claims ### Claim 1 A circuit board core material comprising: a laminate comprising: a prepreg layer; a first clad layer on a first side of said prepreg layer wherein said prepreg layer comprises a pocket; and an electronic component in said pocket wherein said electronic component comprises a first external termination and a second external termination wherein said first external termination is laminated to and in electrical contact with said first clad layer and said second external termination is laminated to and in electrical contact with a conductor. ### Claim 2 (depends on 1) The circuit board core material of claim 1 wherein said prepreg layer is a cured prepreg layer. ### Claim 3 (depends on 1) The circuit board core material of claim 1 wherein said external terminations and clad layer are substantially planar. ### Claim 4 (depends on 1) The circuit board core material of claim 1 further comprising a second clad layer on a second side opposite said first side. ### Claim 5 (depends on 1) The circuit board core material of claim 1 wherein said electronic component is selected from the group consisting of capacitor, resistor, silicon die, diode, inductive material, and magnetic device. ### Claim 6 (depends on 5) The circuit board core material of claim 5 wherein said capacitor is selected from a foil capacitor, a pressed powder capacitor, and a ceramic capacitor. ### Claim 7 (depends on 5) The circuit board core material of claim 5 wherein said capacitor comprises a porous valve metal layer. ### Claim 8 (depends on 7) The circuit board core material of claim 7 wherein said capacitor comprises a dielectric on said porous valve metal layer. ### Claim 9 (depends on 7) The circuit board core material of claim 7 wherein said valve metal is selected from the group consisting of aluminum, tantalum, niobium and NbO. ### Claim 10 (depends on 7) The circuit board core material of claim 7 wherein said porous valve metal layer is a foil. ### Claim 11 (depends on 5) The circuit board core material of claim 5 wherein said capacitor comprises a metalized cathode layer. ### Claim 12 (depends on 1) The circuit board core material of claim 1 wherein said first external termination is a counter electrode. ### Claim 13 (depends on 12) The circuit board core material of claim 12 further comprising a conductive paint on said counter electrode. ### Claim 14 (depends on 13) The circuit board core material of claim 13 wherein said conductive paint comprises at least one of a carbon filled resin or a metal filled resin. ### Claim 15 (depends on 1) The circuit board core material of claim 1 wherein said first clad layer comprises copper. ### Claim 16 (depends on 1) The circuit board core material of claim 1 further comprising a cathode isolation region. ### Claim 17 (depends on 16) The circuit board core material of claim 16 further wherein said cathode isolation region comprises an isolation material. ### Claim 18 (depends on 1) The circuit board core material of claim 1 further comprising an anode isolation region. ### Claim 19 (depends on 18) The circuit board core material of claim 18 further wherein said anode isolation region comprises an isolation material. ### Claim 20 (depends on 1) The circuit board core material of claim 1 further comprising a via pass through section. ### Claim 21 (depends on 1) The circuit board core material of claim 1 further comprising a conductive node. ### Claim 22 (depends on 21) The circuit board core material of claim 21 wherein said conductive node is an anode conductive node. ### Claim 23 (depends on 1) The circuit board core material of claim 1 comprising multiple electronic components. ### Claim 24 (depends on 1) The circuit board core material of claim 1 further comprising at least one clad bonding layer. ### Claim 25 (depends on 1) The circuit board core material of claim 1 further comprising at least one electrical connection layer between adjacent said external termination and clad layer. ### Claim 26 (depends on 1) The circuit board core material of claim 1 further comprising a prepreg layer laminated on opposite side of electronic component from first clad layer. ### Claim 27 (depends on 1) The circuit board core material of claim 1 wherein said first clad layer has been etched. ### Claim 28 (depends on 1) The circuit board core material of claim 1 wherein said circuit board core material is flexible. ### Claim 29 A circuit board comprising: a primary laminate comprising: a circuit board core material layered with circuit board material wherein said circuit board material is laminated to said circuit board core material to form said laminate wherein said circuit board core material comprises: a laminate comprising: a prepreg layer; a first clad layer on a first side of said prepreg layer wherein said prepreg layer comprises a pocket; and an electronic component in said pocket wherein said electronic component comprises a first external termination and a second external termination wherein said first external termination is laminated to and in electrical contact with said first clad layer and said second external termination is in electrical contact with a conductor. ### Claim 30 (depends on 29) The circuit board of claim 29 wherein said prepreg layer is a cured prepreg layer. ### Claim 31 (depends on 29) The circuit board of claim 29 wherein said external terminations and clad layer are substantially planar. ### Claim 32 (depends on 29) The circuit board of claim 29 further comprising a second clad layer on a second side of said prepreg layer opposite said first side. ### Claim 33 (depends on 29) The circuit board of claim 29 further comprising at least one via. ### Claim 34 (depends on 29) The circuit board of claim 29 further comprising at least one electronic component on said circuit board. ### Claim 35 (depends on 29) The circuit board of claim 29 wherein said electronic component is selected from the group consisting of capacitor, resistor, silicon die, diode, inductive material and magnetic device. ### Claim 36 (depends on 35) The circuit board of claim 35 wherein said capacitor is selected from a foil capacitor, a pressed powder capacitor and a ceramic capacitor. ### Claim 37 (depends on 35) The circuit board of claim 35 wherein said capacitor comprises a porous valve metal layer. ### Claim 38 (depends on 37) The circuit board of claim 37 wherein said capacitor comprises a dielectric on said porous valve metal layer. ### Claim 39 (depends on 37) The circuit board of claim 37 wherein said valve metal is selected from the group consisting of aluminum, tantalum, niobium and NbO. ### Claim 40 (depends on 35) The circuit board of claim 35 wherein said porous valve metal layer is a foil. ### Claim 41 (depends on 35) The circuit board of claim 35 wherein said capacitor comprises a metalized cathode layer. ### Claim 42 (depends on 29) The circuit board of claim 29 wherein said first external termination is a counter electrode. ### Claim 43 (depends on 42) The circuit board of claim 42 further comprising a conductive paint on said counter electrode. ### Claim 44 (depends on 43) The circuit board of claim 43 wherein said conductive paint comprises at least one of a carbon filled resin or a metal filled resin. ### Claim 45 (depends on 29) The circuit board of claim 29 wherein said first clad layer comprises copper. ### Claim 46 (depends on 29) The circuit board of claim 29 further comprising a cathode isolation region. ### Claim 47 (depends on 46) The circuit board of claim 46 further wherein said cathode isolation region comprises an isolation material. ### Claim 48 (depends on 29) The circuit board of claim 29 further comprising an anode isolation region. ### Claim 49 (depends on 48) The circuit board of claim 48 further wherein said anode isolation region comprises an isolation material. ### Claim 50 (depends on 29) The circuit board of claim 29 further comprising a via pass through region. ### Claim 51 (depends on 29) The circuit board of claim 29 further comprising a conductive node. ### Claim 52 (depends on 51) The circuit board of claim 51 wherein said conductive node is an anode conductive node. ### Claim 53 (depends on 29) The circuit board of claim 29 comprising multiple electronic components. ### Claim 54 (depends on 29) The circuit board of claim 29 further comprising at least one clad bonding layer. ### Claim 55 (depends on 29) The circuit board of claim 29 further comprising at least one electrical connection layer between adjacent said external termination and clad layer. ### Claim 56 (depends on 29) The circuit board of claim 29 further comprising a prepreg layer laminated on opposite side of electronic component from first clad layer. ### Claim 57 (depends on 29) The circuit board of claim 29 wherein said first clad layer has been etched. ### Claim 58 (depends on 29) The circuit board of claim 29 wherein said circuit board core material is flexible. ### Claim 59 A method of making a circuit board core material by: providing a laminate comprising prepreg and at least one clad layer one side of said prepreg; forming a pocket in said prepreg; inserting an electronic component in said prepreg wherein said electronic component comprises a first external termination and a second external termination; curing said prepreg to form prepreg with said electronic component in said prepreg; forming a first electrical connection by laminating said first external termination to said first clad layer; and forming a second electrical connection to said second external termination. ### Claim 60 (depends on 59) The method of making a circuit board of claim 59 wherein said laminate further comprises a second clad layer and said forming said second electrical connection includes laminating said second external termination to said second clad layer ### Claim 61 (depends on 59) The method of making a circuit board of claim 59 further laminating at least one printed circuit board to said circuit board core material. ### Claim 62 (depends on 61) The method of making a circuit board of claim 61 further comprising forming at least one via in said printed circuit board. ### Claim 63 (depends on 59) The method of making a circuit board of claim 59 further comprising at least one electronic component on said circuit board. ### Claim 64 (depends on 63) The method of making a circuit board of claim 63 wherein said electronic component is selected from the group consisting of capacitor, resistor, silicon die, diode, inductive material and magnetic device. ### Claim 65 (depends on 64) The method of making a circuit board of claim 64 wherein said capacitor is selected from a foil capacitor, a pressed powder capacitor and a ceramic capacitor. ### Claim 66 (depends on 64) The method of making a circuit board of claim 64 wherein said capacitor comprises a porous valve metal layer. ### Claim 67 (depends on 66) The method of making a circuit board of claim 66 wherein said capacitor comprises a dielectric on said porous valve metal layer. ### Claim 68 (depends on 66) The method of making a circuit board of claim 66 wherein said valve metal is selected from the group consisting of aluminum, tantalum, niobium and NbO. ### Claim 69 (depends on 66) The method of making a circuit board of claim 66 wherein said porous valve metal layer is a foil. ### Claim 70 (depends on 66) The method of making a circuit board of claim 66 wherein said capacitor comprises a capacitor core. ### Claim 71 (depends on 59) The method of making a circuit board of claim 59 wherein said first external termination is a counter electrode. ### Claim 72 (depends on 71) The method of making a circuit board of claim 71 further comprising a conductive paint on said counter electrode. ### Claim 73 (depends on 72) The method of making a circuit board of claim 72 wherein said conductive paint comprises at least one of a carbon filled resin or a metal filled resin. ### Claim 74 (depends on 59) The method of making a circuit board of claim 59 wherein said first clad layer comprises copper. ### Claim 75 (depends on 59) The method of making a circuit board of claim 59 further comprising a cathode isolation region. ### Claim 76 (depends on 75) The method of making a circuit board of claim 75 further wherein said cathode isolation region comprises an isolation material. ### Claim 77 (depends on 59) The method of making a circuit board of claim 59 further comprising an anode isolation region. ### Claim 78 (depends on 77) The method of making a circuit board of claim 77 further wherein said anode isolation region comprises an isolation material. ### Claim 79 (depends on 59) The method of making a circuit board of claim 59 further comprising a via pass through section. ### Claim 80 (depends on 59) The method of making a circuit board of claim 59 further comprising a conductive node. ### Claim 81 (depends on 80) The method of making a circuit board of claim 80 wherein said conductive node is an anode conductive node. ### Claim 82 (depends on 59) The method of making a circuit board of claim 59 comprising multiple electronic components. ### Claim 83 (depends on 59) The method of making a circuit board of claim 59 further comprising forming at least one clad bonding layer. ### Claim 84 (depends on 59) The method of making a circuit board of claim 59 further comprising forming at least one electrical connection layer between adjacent clad layer. ### Claim 85 (depends on 59) The method of making a circuit board of claim 59 further comprising forming a prepreg layer laminated on opposite side of electronic component from first clad layer. ### Claim 86 (depends on 59) The method of making a circuit board of claim 59 further comprising etching said first clad layer. ### Claim 87 (depends on 59) The method of making a circuit board of claim 59 wherein said circuit board core material is flexible.