# US 2021/0243892 A1 · Wiring substrate and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0243892 A1 - Document ID: US20210243892A1 - Status: Published application - Kind: A1 - Application number: 17/269,054 - Filed: 2019-08-27 - Published: 2021-08-05 - Earliest claimed: 2018-08-28 - Assignees: KYOCERA Corporation - Applicants: KYOCERA Corporation - Inventors: Seiichirou ITOU; Yuichiro ISHIZAKI; Genshitaro KAWAMURA - Web page: https://patentgrep.com/patent/US20210243892A1 ## CPC - H05K 1/053: {the metal substrate being covered by an inorganic insulating layer} - H05K 1/167: {incorporating printed resistors} - H05K 1/0265: {characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections} - H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion} - H05K 1/09: Use of materials for the {conductive, e.g. } metallic pattern - H05K 1/16: incorporating printed electric components, e.g. printed resistors, capacitors or inductors - H10W 70/468: {Circuit boards} - H10W 70/68: Shapes or dispositions thereof - H10W 70/6875: {being on a metallic substrate, e.g. insulated metal substrates [IMS]} - H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass} - H05K 3/146: {By vapour deposition} - H05K 2201/0317: Thin film conductor layer; Thin film passive component - H05K 2201/0338: Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer - H05K 2201/068: wherein the coefficient of thermal expansion is important - H05K 2201/09736: Varying thickness of a single conductor; Conductors in the same plane having different thicknesses - H05K 2201/098: Special shape of the cross-section of conductors, e.g. very thick plated conductors - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A wiring substrate includes: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protrudes from the side along the principal face. ## Claims ### Claim 1 A wiring substrate, comprising: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protruding from the side along the principal face. ### Claim 2 (depends on 1) The wiring substrate according to claim 1, wherein the wiring line comprises at the side an inclined portion, the inclined portion inclined toward the protruding portion; and connected to the protruding portion. ### Claim 3 (depends on 1) The wiring substrate according to claim 1, wherein the wiring line comprises an adherent layer, a barrier layer, and a principal conductor layer, which are arranged, in multi-layer form, in an order from the principal face of the insulating substrates; and the protruding portion comprises a part of the principal conductor layer. ### Claim 4 (depends on 3) The wiring substrate according to claim 3, wherein the protruding portion comprises a part of the barrier layer located between the principal conductor layer of the protruding portion and the principal face of the insulating substrate. ### Claim 5 (depends on 4) The wiring substrate according to claim 4, wherein the protruding portion comprises a part of the adherent layer located between the part of the barrier layer of the protruding portion and the principal face of the insulating substrate. ### Claim 6 (depends on 3) The wiring substrate according to claim 3, wherein, in a vertical sectional view of the wiring substrate, a part of the principal conductor layer is located on a side of the barrier layer. ### Claim 7 (depends on 3) The wiring substrate according to claim 3, wherein, in a vertical sectional view of the wiring substrate, a part of the barrier layer and a part of the principal conductor layer are located on a side of the adherent layer and are arranged in that order from the side of the adherent layer. ### Claim 8 (depends on 3) The wiring substrate according to claim 3, wherein a part of the principal conductor layer continuously extends along the side of the wiring line and further along the protruding portion. ### Claim 9 (depends on 3) The wiring substrate according to claim 3, wherein a part of the barrier layer continuously extends along the side of the wiring line and further along the protruding portion. ### Claim 10 (depends on 3) The wiring substrate according to claim 3, wherein a part of the adherent layer continuously extends along the side of the wiring line and further along the protruding portion. ### Claim 11 (depends on 1) An electronic device, comprising: a wiring substrate according to claim 1; a resistor layer located on the wiring line; and an electronic component mounted on the wiring substrate. ### Claim 12 (depends on 2) The wiring board according to claim 2, wherein the wiring line comprises an adherent layer, a barrier layer, and a principal conductor layer, which are arranged, in multi-layer form, in an order from the principal face of the insulating substrate; and the protruding portion comprises a part of the principal conductor layer. ### Claim 13 (depends on 4) The wiring board according to claim 4, wherein, in a vertical sectional view of the wiring board, a part of the principal conductor layer is located on a side of the barrier layer. ### Claim 14 (depends on 5) The wiring board according to claim 5, wherein, in a vertical sectional view of the wiring board, a part of the principal conductor layer is located on a side of the barrier layer. ### Claim 15 (depends on 4) The wiring board according to claim 4, wherein, in a vertical sectional view of the wiring board, a part of the barrier layer and a part of the principal conductor layer are located on a side of the adherent layer, and which are arranged in that order from the side of the adherent layer. ### Claim 16 (depends on 5) The wiring board according to claim 5, wherein, in a vertical sectional view of the wiring board, a part of the barrier layer and a part of the principal conductor layer are located on a side of the adherent layer, and which are arranged in that order from the side of the adherent layer. ### Claim 17 (depends on 6) The wiring board according to claim 6, wherein, in a vertical sectional view of the wiring board, a part of the barrier layer and a part of the principal conductor layer are located on a side of the adherent layer, and which are arranged in that order from the side of the adherent layer. ### Claim 18 (depends on 12) The wiring board according to claim 12, wherein a part of the principal conductor layer continuously extends along the side of the wiring line and further along the protruding portion. ### Claim 19 (depends on 12) The wiring board according to claim 12, wherein a part of the barrier layer continuously extends along the side of the wiring line and further along the protruding portion. ### Claim 20 (depends on 12) The wiring board according to claim 12, wherein a part of the adherent layer continuously extends along the side of the wiring line and further along the protruding portion.