# US 2021/0243886 A1 · Wiring substrate and current measuring device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0243886 A1 - Document ID: US20210243886A1 - Status: Published application - Kind: A1 - Application number: 16/942,567 - Filed: 2020-07-29 - Published: 2021-08-05 - Earliest claimed: 2020-02-03 - Assignees: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation - Applicants: Kabushiki Kaisha Toshiba; Toshiba Electronic Devices & Storage Corporation - Inventors: Shinji OSHIMA - Web page: https://patentgrep.com/patent/US20210243886A1 ## CPC - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H10W 70/685: comprising multiple insulating layers - G01R 19/0092: {Measuring current only} - G01R 31/52: Testing for short-circuits, leakage current or ground faults - H05K 1/115: {Via connections; Lands around holes or via connections (H05K1/112 takes precedence)} - H05K 1/181: associated with surface mounted components - H05K 1/0268: {for electrical inspection or testing} - H05K 1/0298: {Multilayer circuits} - H05K 2201/0723: provided by an inner layer of PCB - H05K 2201/10151: Sensor - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A wiring substrate includes an insulating body; a first conductor including a first shield layer provided in a first layer inside the insulating body, and a second shield layer provided in a second layer at a different position from the first layer in a thickness direction of the insulating body; a second conductor including a first guard layer provided in a third layer positioned between the first layer and the second layer in the thickness direction, and a second guard layer provided in a fourth layer positioned between the second layer and the third layer in the thickness direction; and a third conductor provided in a fifth layer positioned between the third layer and the fourth layer in the thickness direction. ## Claims ### Claim 1 A wiring substrate, comprising: an insulating body; a first conductor including a first shield layer provided in a first layer inside the insulating body, and a second shield layer provided in a second layer at a different position from the first layer in a thickness direction of the insulating body; a second conductor including a first guard layer provided in a third layer positioned between the first layer and the second layer in the thickness direction, and a second guard layer provided in a fourth layer positioned between the second layer and the third layer in the thickness direction; and a third conductor provided in a fifth layer positioned between the third layer and the fourth layer in the thickness direction. ### Claim 2 (depends on 1) The wiring substrate according to claim 1, further comprising: a first through-hole extending in the thickness direction between the third conductor and a surface of the insulating body, the first through-hole being connected to the third conductor; a second through-hole extending in the thickness direction between the second conductor and the surface of the insulating body, the second through-hole being connected to the second conductor; and a third through-hole extending in the thickness direction between the first conductor and the surface of the insulating body, the third through-hole being connected to the first conductor. ### Claim 3 (depends on 2) The wiring substrate according to claim 2, wherein an end portion of the first through-hole, an end portion of the second through-hole, and an end portion of the third through-hole are exposed at a same surface of the insulating body. ### Claim 4 (depends on 1) The wiring substrate according to claim 1, wherein the second conductor further includes a first semiconductor layer stacked with the first guard layer, and a second semiconductor layer stacked with the second guard layer. ### Claim 5 (depends on 1) The wiring substrate according to claim 1, wherein the third conductor is formed in a line configuration, and the second conductor and the first conductor each have greater surface areas than the third conductor. ### Claim 6 (depends on 1) The wiring substrate according to claim 1, wherein the first conductor is grounded. ### Claim 7 (depends on 1) The wiring substrate according to claim 1, wherein a same potential is applied to the second and third conductors. ### Claim 8 (depends on 1) The wiring substrate according to claim 1, wherein the first shield layer, the second shield layer, the first guard layer, the second guard layer, and the third conductor are metal layers. ### Claim 9 (depends on 1) A current measuring device, comprising: the wiring substrate according to claim 1; a probe provided at one surface of two surfaces of the wiring substrate, the probe being connected to the third conductor; a connector provided at the other surface of the two surfaces of the wiring substrate, the connector being connected to the first, second, and third conductors; and a power supply unit connected to the connector. ### Claim 10 (depends on 9) The wiring substrate according to claim 9, further comprising: a first through-hole extending in the thickness direction between the third conductor and a surface of the insulating body, the first through-hole being connected to the third conductor; a second through-hole extending in the thickness direction between the second conductor and the surface of the insulating body, the second through-hole being connected to the second conductor; and a third through-hole extending in the thickness direction between the first conductor and the surface of the insulating body, the third through-hole being connected to the first conductor. ### Claim 11 (depends on 10) The wiring substrate according to claim 10, wherein an end portion of the first through-hole, an end portion of the second through-hole, and an end portion of the third through-hole are exposed at a same surface of the insulating body, and are connected to the connector. ### Claim 12 (depends on 9) The wiring substrate according to claim 9, wherein the second conductor further includes a first semiconductor layer stacked with the first guard layer, and a second semiconductor layer stacked with the second guard layer. ### Claim 13 (depends on 9) The wiring substrate according to claim 9, wherein the third conductor is formed in a line configuration, and the second conductor and the first conductor each have greater surface areas than the third conductor. ### Claim 14 (depends on 9) The wiring substrate according to claim 9, wherein the first conductor is grounded. ### Claim 15 (depends on 9) The wiring substrate according to claim 9, wherein a same potential is applied to the second and third conductors. ### Claim 16 (depends on 9) The wiring substrate according to claim 9, wherein the first shield layer, the second shield layer, the first guard layer, the second guard layer, and the third conductor are metal layers.