# US 2021/0243883 A1 · Flexible substrate and display device including the same

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- Number: US 2021/0243883 A1
- Document ID: US20210243883A1
- Status: Published application
- Kind: A1
- Application number: 17/235,859
- Filed: 2021-04-20
- Published: 2021-08-05
- Earliest claimed: 2018-06-22
- Assignees: Samsung Display Co., Ltd.
- Applicants: Samsung Display Co., Ltd.
- Inventors: Jeungsoo KIM; Yun-ho KIM
- Web page: https://patentgrep.com/patent/US20210243883A1

## CPC

- H05K 1/028: {Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence)}
- H05K 3/281: {by means of a preformed insulating foil (H05K3/284 takes precedence)}
- G06F 3/044: by capacitive means
- H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)}
- H05K 1/0281: {Reinforcement details thereof}
- H05K 1/189: characterised by the use of flexible or folded printed circuits
- H10K 59/131: Interconnections, e.g. wiring lines or terminals
- H10K 59/40: OLEDs integrated with touch screens
- G02F 1/13338: {Input devices, e.g. touch panels}
- H05K 1/147: {at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit (H05K1/148 takes precedence)}
- H05K 3/361: {Assembling flexible printed circuits with other printed circuits}
- H05K 2201/10128: Display
- H10K 77/111: {Flexible substrates}
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS

## Abstract

A display device includes a display module configured to display an image, and a flexible substrate including a first bonding region connected to the display module, with the flexible substrate bent such that a portion thereof is disposed under the display module. The flexible substrate may include a circuit layer electrically connecting the display module to a printed circuit board, a cover layer on the circuit layer, and a bubble-prevention layer disposed between the cover layer and the circuit layer and configured to overlap with the first bonding region, wherein the display module includes a non-display region surrounding a display region, the non-display region includes a pad region to which the flexible substrate is connected, and the bubble-prevention layer overlaps the pad region, and the bubble-prevention layer does not overlap the display area.

## Claims

### Claim 1

A display device, comprising:
a display module configured to display an image; and
a flexible substrate comprising a first bonding region connected to the display module, the flexible substrate being bent so that at least a portion of the flexible substrate is disposed under the display module, wherein:
the flexible substrate comprises:
a circuit layer electrically connected to the display module;
a cover layer disposed on the circuit layer; and
a bubble-prevention layer disposed between the cover layer and the circuit layer and configured to overlap with the first bonding region,
the display module includes a display region configured to display the image and a non-display region surrounding the display region,
the non-display region includes a pad region to which the flexible substrate is connected, and
is the bubble-prevention layer overlaps the pad region and does not overlap the display region.

### Claim 2 (depends on 1)

The display device of claim 1, further comprising a printed circuit board disposed below the display module,
wherein circuit layer electrically connects the display module to the printed circuit board.

### Claim 3 (depends on 2)

The display device of claim 2, the flexible substrate further comprising a second bonding region which is connected to the printed circuit board, and a bending region which is defined between the first and second bonding regions to connect the first bonding region to the second bonding region.

### Claim 4 (depends on 3)

The display device of claim 3, wherein the bubble-prevention layer is configured to not overlap with the bending region.

### Claim 5 (depends on 3)

The display device of claim 3, wherein the bending region comprises a maximum stress region,
a thickness of the flexible substrate is smaller in the maximum stress region than in other regions of the bending region, and
the bubble-prevention layer is configured to overlap with a region on the flexible substrate other than the maximum stress region.

### Claim 6 (depends on 1)

The display device of claim 1, wherein the circuit layer extends a length of the flexible substrate, and
the cover layer extends the length of the flexible substrate.

### Claim 7 (depends on 6)

The display device of claim 6, wherein the bubble-prevention layer is disposed directly between the cover layer and the circuit layer, and the bubble-prevention layer contacts each of the cover layer and the circuit layer.