# US 2021/0243392 A1 · Solid-state imaging device and electronic apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0243392 A1 - Document ID: US20210243392A1 - Status: Published application - Kind: A1 - Application number: 16/972,172 - Filed: 2019-03-26 - Published: 2021-08-05 - Earliest claimed: 2018-06-12 - Assignees: Sony Semiconductor Solutions Corporation - Applicants: Sony Semiconductor Solutions Corporation - Inventors: LUONGHUNG ASAKURA - Web page: https://patentgrep.com/patent/US20210243392A1 ## CPC - H04N 25/617: for reducing electromagnetic interference, e.g. clocking noise - H04N 25/76: Addressed sensors, e.g. MOS or CMOS sensors - H04N 25/60: Noise processing, e.g. detecting, correcting, reducing or removing noise - H04N 25/677: for reducing the column or line fixed pattern noise - H04N 25/78: Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract Provided is a new solid-state imaging device and electronic apparatus capable of eliminating streaking. Provided is a solid-state imaging device including: plurality of pixels provided in a pixel region on a substrate in a matrix form; a plurality of first wirings commonly provided to each of the plurality of pixels arranged along a first direction; a second wiring capacitively coupled to each of the plurality of first wirings; and a second detection unit that is electrically connected to the second wiring and detects a second signal appearing on the second wiring. ## Claims ### Claim 1 A solid-state imaging device comprising: a plurality of pixels provided in a pixel region on a substrate in a matrix form; a plurality of first wirings commonly provided to each of the plurality of pixels arranged along a first direction; a second wiring capacitively coupled to each of the plurality of first wirings; and a second detection unit that is electrically connected to the second wiring and detects a second signal appearing on the second wiring. ### Claim 2 (depends on 1) The solid-state imaging device according to claim 1, further comprising: a plurality of first detection units that are electrically connected to each of the first wirings and detect a first signal appearing on each of the first wirings. ### Claim 3 (depends on 2) The solid-state imaging device according to claim 2, wherein the plurality of first detection units and the second detection unit are analog-digital converters arranged in a detection unit region on the substrate. ### Claim 4 (depends on 3) The solid-state imaging device according to claim 3, wherein the plurality of first detection units and the second detection unit have the same circuit configuration. ### Claim 5 (depends on 4) The solid-state imaging device according to claim 4, wherein the second wiring is electrically connected to a bias circuit via a switch. ### Claim 6 (depends on 2) The solid-state imaging device according to claim 2, further comprising: a processing unit that estimates a noise amount based on a signal amount detected by the second detection unit, and corrects a signal amount detected by the plurality of first detection units using the estimated noise amount. ### Claim 7 (depends on 1) The solid-state imaging device according to claim 1, wherein a first capacitance value of a first coupling capacitor generated by capacitively coupling the first wiring and the second wiring is proportional to an area of a region in which the first wiring and the second wiring overlay each other. ### Claim 8 (depends on 7) The solid-state imaging device according to claim 7, further comprising: a capacitor that is electrically connected to the second wiring and has a second capacitance value. ### Claim 9 (depends on 7) The solid-state imaging device according to claim 7, wherein the second wiring is capacitively coupled to a third wiring to generate a second coupling capacitor having a second capacitance value. ### Claim 10 (depends on 8) The solid-state imaging device according to claim 8, wherein the second capacitance value is greater than the first capacitance value. ### Claim 11 (depends on 1) The solid-state imaging device according to claim 1, wherein each of the first wirings extends along the first direction on the substrate, and the second wiring extends along a second direction orthogonal to the first direction on the substrate. ### Claim 12 (depends on 3) The solid-state imaging device according to claim 3, wherein a plurality of the second wirings and a plurality of the second detection units are provided, and each of the second wirings is capacitively coupled to a predetermined number of first wirings. ### Claim 13 (depends on 12) The solid-state imaging device according to claim 12, wherein in the detection unit region, the predetermined number of first detection units are alternately arranged to the second detection units. ### Claim 14 (depends on 3) The solid-state imaging device according to claim 3, wherein a plurality of the second wirings and a plurality of the second detection units are provided, and the second detection units are provided so that an array region in which the plurality of first detection units are arranged is sandwiched therebetween. ### Claim 15 (depends on 3) The solid-state imaging device according to claim 3, wherein the pixel region is provided on a first surface of the substrate, and the detection unit region is provided on a second surface of the substrate different from the first surface. ### Claim 16 (depends on 3) The solid-state imaging device according to claim 3, wherein the pixel region is provided on a first substrate, and the detection unit region is provided on a second substrate different from the first substrate. ### Claim 17 (depends on 1) The solid-state imaging device according to claim 1, further comprising: a load device region in which a plurality of load devices each electrically connected to each of the first wirings are arranged on the substrate. ### Claim 18 An electronic apparatus comprising a solid-state imaging device, wherein the solid-state imaging device includes: a plurality of pixels provided in a pixel region on a substrate in a matrix form; a plurality of first wirings commonly provided to each of the plurality of pixels arranged along a first direction; a second wiring capacitively coupled to each of the plurality of first wirings; and a second detection unit that is electrically connected to the second wiring and detects a second signal appearing on the second wiring.