# US 2021/0242593 A1 · Antenna module and electronic device including the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0242593 A1 - Document ID: US20210242593A1 - Status: Published application - Kind: A1 - Application number: 17/234,857 - Filed: 2021-04-20 - Published: 2021-08-05 - Earliest claimed: 2018-12-14 - Assignees: Samsung Electro-Mechanics Co., Ltd. - Applicants: Samsung Electro-Mechanics Co., Ltd. - Inventors: Young Kyoon IM - Web page: https://patentgrep.com/patent/US20210242593A1 ## CPC - H01Q 9/045: {with particular feeding means (for circular polarisation H01Q9/0428)} - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/241: {used in mobile communications, e.g. GSM (H01Q1/247, H01Q1/248 take precedence)} - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H01Q 21/065: {Patch antenna array} - H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections - H10W 40/778: {in encapsulations} - H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 70/611: {for connecting multiple chips together} - H10W 70/614: {the multiple chips being integrally enclosed} - H10W 70/65: Shapes or dispositions of interconnections - H10W 70/685: comprising multiple insulating layers - H10W 70/688: {Flexible insulating substrates} - H10W 74/117: {the substrate having spherical bumps for external connection} - H10W 76/157: having interconnections parallel to the insulating or insulated base - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H01Q 1/523: {between antennas of an array} - H10W 44/241: {for passive devices or passive elements} - H10W 44/248: {for antennas} - H10W 70/68: Shapes or dispositions thereof - H10W 70/695: Organic materials - H10W 74/114: {by a substrate and the encapsulations} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An antenna module includes: an antenna package including a patch antenna; an integrated circuit (IC) package including an IC; a connection member configured such that a portion of the connection member is disposed between the antenna package and the IC package, and having a laminated structure electrically connecting the patch antenna to the IC; and a chip antenna disposed on the connection member and including a first electrode electrically connected to the IC, a dielectric body disposed on a surface of the first electrode, and a second electrode spaced apart from the first electrode and disposed on the dielectric body. The connection member includes a first region disposed between the antenna package and the IC package, and a second region extending farther than the antenna package in a direction different from a direction in which the connection member is laminated. The chip antenna is disposed in the second region. ## Claims ### Claim 1 An antenna module, comprising: an antenna package comprising patch antennas and a dielectric layer providing arrangement areas to the patch antennas; a connection member connected to the antenna package and comprising an insulating layer having a flexibility greater than a flexibility of the dielectric layer; and chip antennas connected to the connection member and comprising dielectric bodies disposed to be spaced apart from each other, first electrodes disposed on first sides of the dielectric bodies, and second electrodes disposed on second sides of the dielectric bodies, wherein the connection member further comprises: first feed lines electrically connected to the patch antennas; second feed lines electrically connected to the first electrodes of the chip antennas; and a ground layer disposed between at least a portion of the first and second feed lines and the antenna package. ### Claim 2 (depends on 1) The antenna module of claim 1, wherein the second electrodes are electrically connected to the ground layer. ### Claim 3 (depends on 1) The antenna module of claim 1, further comprising feed vias electrically connected to the first feed lines and disposed to penetrate through the ground layer. ### Claim 4 (depends on 1) The antenna module of claim 1, further comprising: first electrode pads disposed between the connection member and the first electrodes; and second electrode pads disposed between the connection member and the second electrodes, wherein the chip antennas are mounted on the first and second electrode pads. ### Claim 5 (depends on 1) The antenna module of claim 1, wherein each of the dielectric bodies is disposed between each of the first electrodes and each of the second electrodes. ### Claim 6 (depends on 1) The antenna module of claim 1, wherein each of the first and second electrodes has a planar shape. ### Claim 7 (depends on 1) The antenna module of claim 1, wherein the patch antennas comprise: patch antenna patterns disposed on a first layer of the antenna package; and coupling patch patterns disposed on a second layer of the antenna package. ### Claim 8 (depends on 1) The antenna module of claim 1, wherein the antenna package further comprises a coupling structure surrounding at least a portion of the patch antennas. ### Claim 9 (depends on 1) The antenna module of claim 1, further comprising an integrated circuit (IC) connected to the first and second feed lines. ### Claim 10 (depends on 9) The antenna module of claim 9, wherein the IC is disposed on the connection member. ### Claim 11 (depends on 1) The antenna module of claim 1, wherein the connection member comprises a first region on which the antenna package is disposed and a second region on which at least a portion of the chip antennas is disposed, and wherein the first electrodes are disposed to be not parallel with the second region. ### Claim 12 (depends on 11) The antenna module of claim 11, wherein the connection member further comprises a third region extending in a direction different from a direction in which the second region extends from the first region. ### Claim 13 (depends on 12) The antenna module of claim 12, wherein the chip antennas comprise first chip antennas disposed on the second region and second chip antennas disposed on the third region. ### Claim 14 (depends on 11) The antenna module of claim 11, wherein the second region of the connection member comprises: a rigid region providing a layout space of the chip antenna; and a flex region connecting the first region of the connection member to the rigid region, and wherein the flex region is more flexible than the rigid region. ### Claim 15 (depends on 11) The antenna module of claim 11, wherein a thickness of the first region is greater than a thickness of the second region. ### Claim 16 (depends on 1) An electronic device, comprising: the antenna module of claim 1; and a case accommodating the antenna module. ### Claim 17 (depends on 16) The electronic device of claim 16, wherein the patch antennas are disposed such that planes of the patch antennas face an upper surface of the case or a lower surface of the case, and wherein each of distances by which the chip antennas are spaced from a side surface of the case is less than each of distances by which the patch antennas are spaced from the side surface of case. ### Claim 18 (depends on 16) The electronic device of claim 16, wherein the connection member comprises a first region on which the antenna package is disposed, a second region on which at least a portion of the chip antennas is disposed, and a third region extending in a direction different from a direction in which the second region extends from the first region. ### Claim 19 (depends on 18) The electronic device of claim 18, wherein the chip antennas comprise first chip antennas disposed on the second region and second chip antennas disposed on the third region. ### Claim 20 (depends on 18) The electronic device of claim 18, further comprising a set substrate accommodated by the case, wherein the third region is connected between the set substrate and the antenna module.