# US 2021/0242568 A1 · High-Bandwidth Antenna In Package Apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0242568 A1 - Document ID: US20210242568A1 - Status: Published application - Kind: A1 - Application number: 17/234,920 - Filed: 2021-04-20 - Published: 2021-08-05 - Earliest claimed: 2018-10-26 - Assignees: Huawei Technologies Co., Ltd. - Applicants: Huawei Technologies Co., Ltd. - Inventors: Haiwei ZHANG; Haotao HU; Yaojiang ZHANG - Web page: https://patentgrep.com/patent/US20210242568A1 ## CPC - H01Q 1/2283: {mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package} - H01Q 1/243: {with built-in antennas} - H01Q 1/48: Earthing means; Earth screens; Counterpoises - H01Q 9/28: Conical, cylindrical, cage, strip, gauze, or like elements having an extended radiating surface; Elements comprising two conical surfaces having collinear axes and adjacent apices and fed by two-conductor transmission lines (waveguide horns or mouths H01Q13/00; slot antennas H01Q13/00) - H01Q 9/30: with feed to end of elongated active element, e.g. unipole (H01Q9/44 takes precedence) - H01Q 13/02: Waveguide horns - H01Q 13/085: {Slot-line radiating ends} - H01Q 19/108: {Combination of a dipole with a plane reflecting surface (H01Q19/106 takes precedence; strip line H01Q9/065)} - H01Q 19/30: the primary active element being centre-fed and substantially straight, e.g. Yagi antenna - H01Q 21/067: {using endfire radiating aerial units transverse to the plane of the array} - H01Q 21/26: Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre - H01Q 21/28: Combinations of substantially independent non-interacting antenna units or systems {(multiple beam H01Q25/00)} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 44/248: {for antennas} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract This disclosure discloses high-bandwidth antenna in package (AiP) apparatuses. In an example, an AiP apparatus comprises: a first radiator; a second radiator; a first substrate; a second substrate; a first metal piece; and a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the second radiator is disposed on the second substrate, wherein the first feeding path is configured to feed the first radiator, and wherein the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate. ## Claims ### Claim 1 An antenna-in-package apparatus comprising: a first radiator; a second radiator; a first substrate; a second substrate; a first metal piece; and a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the second radiator is disposed on the second substrate, wherein the first feeding path is configured to feed the first radiator, and wherein the second radiator and the first radiator are connected using the first metal piece disposed between the first substrate and the second substrate. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the apparatus further comprises: a second feeding path disposed on the second substrate; and a second metal piece disposed between the first substrate and the second substrate, wherein the second feeding path is configured to feed the second radiator, and wherein the first feeding path and the second feeding path are connected by the second metal piece. ### Claim 3 (depends on 1) The apparatus of claim 1, wherein the first radiator comprises a first ground plate, wherein the second radiator comprises a second ground plate, and wherein the first ground plate and the second ground plate are connected by the first metal piece. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the first radiator comprises a first parasitic radiator, wherein the second radiator comprises a second parasitic radiator, and wherein the first parasitic radiator and the second parasitic radiator are connected by the first metal piece. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the first radiator comprises a first main radiation plate, wherein the second radiator comprises a second main radiation plate, and wherein the first main radiation plate and the second main radiation plate are connected by the first metal piece disposed between the first substrate and the second substrate. ### Claim 6 (depends on 5) The apparatus of claim 5, wherein the first main radiation plate comprises a first positive-polarized element and a first negative-polarized element, wherein the second main radiation plate comprises a second positive-polarized element and a second negative-polarized element, wherein an included angle between the first positive-polarized element and the first negative-polarized element is 90° and wherein an included angle between the second positive-polarized element and the second negative-polarized element is 90°. ### Claim 7 (depends on 2) The apparatus of claim 2, wherein the first radiator comprises a first main radiation plate, the second radiator comprises a second main radiation plate, wherein the first feeding path is configured to perform coupling feeding on the first main radiation plate, and wherein the second feeding path is configured to perform coupling feeding on the second main radiation plate. ### Claim 8 (depends on 2) The apparatus of claim 2, wherein the apparatus further comprises a chip, disposed on a side of the first substrate that faces the second substrate, wherein the chip is configured to provide a radio frequency signal for the first feeding path and the second feeding path. ### Claim 9 (depends on 8) The apparatus of claim 8, wherein maximum radiation directions of the first radiator and the second radiator are perpendicular to a normal line of the chip. ### Claim 10 (depends on 2) The apparatus of claim 2, wherein the first metal piece and the second metal piece are ball grid array (BGA) balls. ### Claim 11 (depends on 2) The apparatus of claim 2, wherein at least one of the first radiator, the second radiator, the first feeding path, or the second feeding path comprises a via. ### Claim 12 (depends on 2) The apparatus of claim 2, wherein at least one of the first radiator, the second radiator, the first feeding path, or the second feeding path comprises via arrays arranged in a staggered manner and a cable for connecting the via arrays. ### Claim 13 A terminal device, comprising an antenna-in-package apparatus, wherein the antenna-in-package apparatus comprises: a first radiator; a second radiator; a first substrate; a second substrate; a first metal piece; and a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the second radiator is disposed on the second substrate, wherein the first feeding path is configured to feed the first radiator, and wherein the second radiator and the first radiator are connected by the first metal piece. ### Claim 14 (depends on 13) The terminal device of claim 13, wherein the terminal device further comprises a third radiator, a first mechanical part, and a third metal piece, wherein the first mechanical part is disposed on a side of the second substrate that is distant from the first substrate, wherein the third radiator is disposed on the first mechanical part, wherein the first feeding path is further configured to feed the third radiator, and wherein the third radiator and the second radiator are connected by the third metal piece disposed between the second substrate and the first mechanical part. ### Claim 15 An antenna-in-package apparatus, comprising: a first radiator; a first substrate; a first metal piece; and a first feeding path, wherein the first radiator and the first feeding path are disposed on the first substrate, wherein the first metal piece is configured to connect the first radiator and a second radiator, wherein the second radiator is disposed on a second substrate, wherein the second substrate is disposed on a side of the first metal piece of the first substrate, and wherein the first feeding path is configured to feed the first radiator. ### Claim 16 (depends on 15) The apparatus of claim 15, wherein the apparatus further comprises a second metal piece configured to connect the first feeding path and a second feeding path, wherein the second feeding path is disposed on the second substrate, and wherein the second feeding path is configured to feed the second radiator. ### Claim 17 (depends on 15) The apparatus of claim 15, wherein the first radiator comprises a first ground plate, wherein the second radiator comprises a second ground plate, and wherein the first ground plate and the second ground plate are connected by the first metal piece. ### Claim 18 (depends on 15) The apparatus of claim 15, wherein the first radiator comprises a first main radiation plate, wherein the second radiator comprises a second main radiation plate, and wherein the first main radiation plate and the second main radiation plate are connected by the first metal piece. ### Claim 19 (depends on 15) The apparatus of claim 15, wherein the first radiator comprises a first parasitic radiator, wherein the second radiator comprises a second parasitic radiator, and wherein the first parasitic radiator and the second parasitic radiator are connected by the first metal piece. ### Claim 20 (depends on 18) The apparatus of claim 18, wherein the first main radiation plate comprises a first positive-polarized element and a first negative-polarized element, wherein the second main radiation plate comprises a second positive-polarized element and a second negative-polarized element, wherein an included angle between the first positive-polarized element and the first negative-polarized element is 90° and wherein an included angle between the second positive-polarized element and the second negative-polarized element is 90°.