# US 2021/0242434 A1 · Display Substrate, Display Device, Mask Plate, and Manufacturing Method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0242434 A1 - Document ID: US20210242434A1 - Status: Published application - Kind: A1 - Application number: 16/650,944 - Filed: 2019-03-27 - Published: 2021-08-05 - Earliest claimed: 2019-03-27 - Assignees: Chengdu Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Applicants: Chengdu Boe Optoelectronics Technology Co., Ltd.; Boe Technology Group Co., Ltd. - Inventors: Bo Zhang; Yao Huang; Meng Li - Web page: https://patentgrep.com/patent/US20210242434A1 ## CPC - G03F 1/38: Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof - H10K 59/124: Insulating layers formed between TFT elements and OLED elements - H10K 59/131: Interconnections, e.g. wiring lines or terminals - H10K 2102/351: {Thickness} - G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G) - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract The present disclosure provides a display substrate, a display device, a mask plate, and a manufacturing method. The manufacturing method includes forming a pattern structure on a base substrate including a first substrate portion and a second substrate portion adjacent to the first substrate portion, wherein the pattern structure is formed on the first substrate portion; forming a planarization layer on the base substrate, which includes a first planarization layer on the first substrate portion and a second planarization layer on the second substrate portion, wherein a projection of the first planarization layer on the base substrate at least partially covers that of the pattern structure on the base substrate; and removing a part of the first planarization layer to reduce a difference between a height of a surface of the first planarization layer and a height of a surface of the second planarization layer. ## Claims ### Claim 1 A manufacturing method for a display substrate, comprising: forming a pattern structure on a base substrate, wherein the base substrate comprises a first substrate portion and a second substrate portion adjacent to the first substrate portion, and the pattern structure is formed on the first substrate portion; forming a planarization layer on the base substrate, the planarization layer comprising a first planarization layer on the first substrate portion and a second planarization layer on the second substrate portion, wherein a projection of the first planarization layer on the base substrate at least partially covers a projection of the pattern structure on the base substrate, and a height from at least part of a surface of the first planarization layer on a side away from the base substrate to the base substrate is higher than a height from a surface of the second planarization layer on a side away from the base substrate to the base substrate; and removing a part of the first planarization layer so as to reduce a height difference between the height from the at least part of the surface of the first planarization layer on the side away from the base substrate to the base substrate and the height from the surface of the second planarization layer on the side away from the base substrate to the base substrate. ### Claim 2 (depends on 1) The manufacturing method according to claim 1, wherein: during a process of forming the planarization layer, a height from the surface of the first planarization layer on the side away from the base substrate to the base substrate is higher than the height from the surface of the second planarization layer on the side away from the base substrate to the base substrate; and the surface of the second planarization layer on the side away from the base substrate comprises a plurality of portions, wherein the plurality of portions of the surface of the second planarization layer on the side away from the base substrate have a same height to the base substrate. ### Claim 3 (depends on 1) The manufacturing method according to claim 1, wherein the projection of the first planarization layer on the base substrate completely covers the projection of the pattern structure on the base substrate. ### Claim 4 (depends on 1) The manufacturing method according to claim 1, wherein the removing of the part of the first planarization layer comprises: performing an exposure process on the first planarization layer by a mask plate, wherein the mask plate comprises at least one first light transmitting region having a slit shape, and the at least one first light transmitting region corresponds to the first planarization layer; and performing a development process on the first planarization layer after the exposure process is performed. ### Claim 5 (depends on 4) The manufacturing method according to claim 4, wherein the mask plate comprises a plurality of first light transmitting regions distributed along the same direction as a length direction of the pattern structure; wherein the greater the height from the at least part of the surface of the first planarization layer on the side away from the base substrate to the base substrate is, the greater a width of a first light transmitting region corresponding to the at least part of the surface of the first planarization layer in the plurality of first light transmitting regions is; or the greater the height from the at least part of the surface of the first planarization layer on the side away from the base substrate to the base substrate is, the greater a distribution density of a first light transmitting region corresponding to the at least part of the surface of the first planarization layer in the plurality of first light transmitting regions is. ### Claim 6 (depends on 1) The manufacturing method according to claim 1, wherein the removing of the part of the first planarization layer comprises: performing a patterning process on the planarization layer after the planarization layer is formed. ### Claim 7 (depends on 6) The manufacturing method according to claim 6, wherein the performing of the patterning process on the planarization layer comprises: performing an exposure process on the planarization layer by a mask plate, wherein the mask plate comprises a first region comprising at least one first light transmitting region having a slit shape and at least one second light transmitting region, and the at least one first light transmitting region corresponds to the first planarization layer; and performing a development process on the planarization layer after the exposure process is performed, so as to remove the part of the first planarization layer, and form a via hole passing through the planarization layer in a part of the planarization layer corresponding to the at least one second light transmitting region. ### Claim 8 (depends on 7) The manufacturing method according to claim 7, wherein: a width of each of the at least one first light transmitting region ranges from 1 micrometer to 1.5 micrometers, and a length of each of the at least one first light transmitting region ranges from 50 micrometers to 55 micrometers; and a radial dimension of each of the at least one second light transmitting region ranges from 4.5 micrometers to 5.5 micrometers. ### Claim 9 (depends on 6) The manufacturing method according to claim 6, wherein the performing of the patterning process on the planarization layer comprises: performing an exposure process on the planarization layer by a mask plate, wherein the mask plate comprises a first region comprising at least one first light transmitting region having a slit shape, and the at least one first light transmitting region corresponds to the first planarization layer; and performing a development process on the planarization layer after the exposure process is performed, wherein a via hole passing through the planarization layer is formed in a part of the planarization layer corresponding to one of the at least one first light transmitting region. ### Claim 10 (depends on 6) The manufacturing method according to claim 6, wherein the performing of the patterning process on the planarization layer comprises: performing an exposure process on the planarization layer by a mask plate, wherein the mask plate comprises a first region comprising a first film layer having a first transmittance and a second film layer having a second transmittance that is adjacent to the first film layer, the first transmittance is less than the second transmittance, the first film layer comprises at least one first light transmitting region having a slit shape, and the at least one first light transmitting region corresponds to the first planarization layer; and performing a development process on the planarization layer after the exposure process is performed, so as to remove a part of the planarization layer corresponding to the second film layer, and to remove a part in a part of the planarization layer corresponding to the first film layer. ### Claim 11 (depends on 9) The manufacturing method according to claim 9, wherein: the mask plate further comprises a second region adjacent to the first region, wherein the second region comprises a third film layer having a third transmittance and a fourth film layer having a fourth transmittance that is adjacent to the third film layer, the third transmittance is less than the fourth transmittance, the third transmittance is not equal to the first transmittance, and the second transmittance is equal to the fourth transmittance. ### Claim 12 (depends on 4) The manufacturing method according to claim 4, wherein the first light transmitting region is a slit. ### Claim 13 (depends on 1) The manufacturing method according to claim 1, further comprising: forming an electrode layer on the planarization layer; and forming a functional layer for a sub-pixel on the electrode layer. ### Claim 14 (depends on 1) The manufacturing method according to claim 1, wherein the pattern structure comprises a conductive wire. ### Claim 15 A display substrate, comprising: a base substrate, wherein the base substrate comprises a first substrate portion and a second substrate portion adjacent to the first substrate portion; a pattern structure on the first substrate portion; and a planarization layer on the base substrate, wherein the planarization layer comprises a first planarization layer on the first substrate portion and a second planarization layer on the second substrate portion, a projection of the first planarization layer on the base substrate at least partially covers a projection of the pattern structure on the base substrate, and the first planarization layer comprises at least one recess. ### Claim 16 (depends on 15) The display substrate according to claim 15, wherein at least part of a projection of the at least one recess on the base substrate overlaps with at least part of the projection of the pattern structure on the base substrate. ### Claim 17 (depends on 15) The display substrate according to claim 15, wherein a depth of the at least one recess ranges from 0.01 micrometer to 0.5 micrometer. ### Claim 18 (depends on 15) The display substrate according to claim 15, wherein: the pattern structure comprises a conductive wire; and the at least one recess comprises a groove; wherein an extending direction of the conductive wire is the same as an extending direction of the groove. ### Claim 19 (depends on 15) The display substrate according to claim 15, further comprising: an electrode layer on the planarization layer and a functional layer for a sub-pixel on the electrode layer. ### Claim 20 (depends on 15) A display device, comprising: the display substrate according to claim 15. ### Claim 21 (canceled)