# US 2021/0242373 A1 · Chip on board display device and method for making the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0242373 A1 - Document ID: US20210242373A1 - Status: Published application - Kind: A1 - Application number: 17/163,750 - Filed: 2021-02-01 - Published: 2021-08-05 - Earliest claimed: 2020-02-05 - Assignees: Macroblock, Inc. - Applicants: Macroblock, Inc. - Inventors: Shih-Sian Liang; Wei-Ming Tseng - Web page: https://patentgrep.com/patent/US20210242373A1 ## CPC - G02B 5/021: {the diffusion taking place at the element's surface, e.g. by means of surface roughening or microprismatic structures} - H10H 20/8506: {Containers} - G02B 1/11: Anti-reflection coatings - G02B 5/0278: {used in transmission} - H10H 20/01: Manufacture or treatment - H10H 20/855: Optical field-shaping means, e.g. lenses - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 90/00: Package configurations - H10H 20/0363: {of optical field-shaping means} - H10H 20/0364: {of interconnections} - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A chip on board (COB) display device includes a substrate, an array of spaced-apart micro light-emitting diode (LED) chips, a light-shielding layer, and an anti-glare layer. The micro LED chips are disposed on the substrate to define thereamong, a recessed portion recessed relative to the micro LED chips. The light-shielding layer is filled in the recessed portion. The anti-glare layer is disposed to cover the light-shielding layer and the micro LED chips, and has a surface which is opposite to the substrate and which is formed with a patterned microstructure. A method for making the COB display device is also disclosed herein. ## Claims ### Claim 1 A chip on board (COB) display device, comprising: a substrate including a first surface and a second surface that are opposite to each other; an array of spaced-apart micro light-emitting diode (LED) chips disposed on said first surface of said substrate to define thereamong, a recessed portion recessed relative to said micro LED chips; a light-shielding layer made of an opaque polymer material, said light-shielding layer being disposed on said first surface and being filled in said recessed portion; and an anti-glare layer made of a light-transmissive optical material, and disposed to cover said light-shielding layer and said micro LED chips, said anti-glare layer having a surface which is opposite to said substrate and which is formed with a patterned microstructure. ### Claim 2 (depends on 1) The COB display device of claim 1, further comprising an anti-reflection layer that is disposed to cover on said patterned microstructure of said anti-glare layer. ### Claim 3 (depends on 2) The COB display device of claim 2, wherein said anti-reflection layer has a refractive index ranging between that of a semiconductor material for making the micro LED chips and that of air. ### Claim 4 (depends on 2) The COB display device of claim 2, further comprising an anti-fingerprint layer that is disposed to cover on said anti-reflection layer opposite to said substrate. ### Claim 5 (depends on 4) The COB display device of claim 4, wherein said anti-fingerprint layer is made of a material selected from the group consisting of fluorine-containing compound, silane compound, and a combination thereof. ### Claim 6 (depends on 1) The COB display device of claim 1, wherein said light-shielding layer is filled to a level not higher than that of said micro LED chips. ### Claim 7 (depends on 1) The COB display device of claim 1, wherein said substrate is a circuit board having a control circuit, said micro LED chips being electrically connected to said control circuit. ### Claim 8 (depends on 1) The COB display device of claim 1, further comprising an active element and a passive element that are disposed on said second surface of said substrate and that are in signal connection with said micro LED chips. ### Claim 9 A method for making a chip on board (COB) display device, comprising the steps of: a) mounting an array of spaced-apart micro light-emitting diode (LED) chips on a first surface of a substrate to permit the micro LED chips to define thereamong, a recessed portion; b) filling an opaque polymer material in the recessed portion by inkjet printing to form a light-shielding layer therein, so as to obtain a semi-finished product; c) providing a mold with a mold-releasing layer which has a micropattern of a concave-convex structure and which is provided for confronting the micro LED chips of the semi-finished product; d) positioning the semi-finished product in a mold cavity of the mold in such a manner that the micro LED chips faces the mold-releasing layer; and e) after step d), introducing a light-transmissive optical material to the mold cavity that is positioned between the semi-finished product and the mold-releasing layer, such that the light-transmissive optical material is cured to form an anti-glare layer that covers the light-shielding layer and the micro LED chips, and such that the micropattern of the mold-releasing layer is transferred to form a patterned microstructure of the anti-glare layer. ### Claim 10 (depends on 9) The method of claim 9, after step e), further comprising a step of: f) forming an anti-reflection layer on the anti-glare layer opposite to the substrate by vacuum coating. ### Claim 11 (depends on 10) The method of claim 10, after step f), further comprising a step of: g) forming an anti-fingerprint layer on the anti-reflection layer opposite to the anti-glare layer by deposition or vacuum coating. ### Claim 12 (depends on 11) The method of claim 11, wherein the substrate includes a circuit, the micro LED chips being mounted to be electrically connected to the circuit in step a). ### Claim 13 (depends on 11) The method of claim 11, after step g), further comprising a step of: h) mounting a plurality of electronic components on a second surface of the substrate opposite to the first surface to permit the electronic components to be electrically connected to at least one portion of the micro LED chips.