# US 2021/0242368 A1 · Multilevel semiconductor device and structure > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0242368 A1 - Document ID: US20210242368A1 - Status: Published application - Kind: A1 - Application number: 17/216,597 - Filed: 2021-03-29 - Published: 2021-08-05 - Earliest claimed: 2010-10-13 - Assignees: Monolithic 3D Inc. - Applicants: Monolithic 3D Inc. - Inventors: Zvi Or-Bach; Deepak C. Sekar - Web page: https://patentgrep.com/patent/US20210242368A1 ## CPC - H10F 39/802: {Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes} - G10L 15/26: Speech to text systems (G10L15/08 takes precedence) - H10F 39/021: {of image sensors having active layers comprising only Group III-V materials, e.g. GaAs, AlGaAs or InP} - H10H 20/817: characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 29/14: comprising multiple light-emitting semiconductor components - H10H 29/142: {Two-dimensional arrangements, e.g. asymmetric LED layout} - H10W 90/00: Package configurations - H10H 20/8312: {extending at least partially through the bodies} - H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION - G10L: SPEECH ANALYSIS TECHNIQUES OR SPEECH SYNTHESIS; SPEECH RECOGNITION; SPEECH OR VOICE PROCESSING TECHNIQUES; SPEECH OR AUDIO CODING OR DECODING - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A 3D micro display, the 3D micro display including: a first single crystal layer including a first plurality of light emitting diodes (LEDs), a second single crystal layer including a second plurality of light emitting diodes (LEDs), where the first single crystal layer includes at least ten individual first LED pixels, where the second single crystal layer includes at least ten individual second LED pixels, where the first plurality of light emitting diodes (LEDs) emits a first light with a first wavelength, where the second plurality of light emitting diodes (LEDs) emits a second light with a second wavelength, where the first wavelength and the second wavelength differ by greater than 10 nm, and where the 3D micro display includes an oxide to oxide bonding structure. ## Claims ### Claim 1 A 3D micro display, the 3D micro display comprising: a first single crystal layer comprising a first plurality of light emitting diodes (LEDs), a second single crystal layer comprising a second plurality of light emitting diodes (LEDs), wherein said first single crystal layer comprises at least ten individual first LED pixels, wherein said second single crystal layer comprises at least ten individual second LED pixels, wherein said first plurality of light emitting diodes (LEDs) emits a first light with a first wavelength, wherein said second plurality of light emitting diodes (LEDs) emits a second light with a second wavelength, wherein said first wavelength and said second wavelength differ by greater than 10 nm, and wherein said 3D micro display comprises an oxide to oxide bonding structure. ### Claim 2 (depends on 1) The 3D micro display according to claim 1, further comprising: a third single crystal layer comprising at least one LED driving circuit, wherein a plurality of said first LED pixels are individually driven, each of said plurality of said first LED pixels is driven by a unique said LED driving circuit, and wherein said third single crystal layer and said first single crystal layer are separated by a vertical distance of less than ten microns and greater than 0.1 microns. ### Claim 3 (depends on 1) The 3D micro display according to claim 1, further comprising: a top surface of said first single crystal layer; and a bottom surface of said second single crystal layer, wherein vertical distance is a distance from said top surface of said first single crystal layer to said bottom surface of said second single crystal layer. ### Claim 4 (depends on 1) The 3D micro display according to claim 1, further comprising: a third single crystal layer, wherein said third single crystal layer overlays said second single crystal layer. ### Claim 5 (depends on 1) The 3D micro display according to claim 1, wherein said second single crystal layer is on top of said first single crystal layer. ### Claim 6 (depends on 1) The 3D micro display according to claim 1, further comprising: a third single crystal layer, wherein said third single crystal layer comprises at least ten third LED pixels. ### Claim 7 A 3D micro display, the 3D micro display comprising: a first single crystal layer comprising at least one LED driving circuit; a second single crystal layer comprising a first plurality of light emitting diodes (LEDs), wherein said second single crystal layer is on top of said first single crystal layer, wherein said second single crystal layer comprises at least ten individual first LED pixels; and a second plurality of light emitting diodes (LEDs), wherein said 3D micro display comprises a bonding structure. ### Claim 8 (depends on 7) The 3D micro display according to claim 7, wherein a plurality of said first LED pixels are individually driven, wherein each of said plurality of said first LED pixels is driven by a unique said at least one LED driving circuit. ### Claim 9 (depends on 7) The 3D micro display according to claim 7, wherein said bonding structure comprises an oxide to oxide bond. ### Claim 10 (depends on 7) The 3D micro display according to claim 7, further comprising: a top surface of said first single crystal layer; and a bottom surface of said second single crystal layer, wherein a vertical distance is a distance from said top surface of said first single crystal layer to said bottom surface of said second single crystal layer, and wherein said vertical distance is less than ten microns and greater than 0.1 microns. ### Claim 11 (depends on 7) The 3D micro display according to claim 7, wherein said first plurality of light emitting diodes (LEDs) emits a first light with a first wavelength, wherein said second plurality of light emitting diodes (LEDs) emits a second light with a second wavelength, and wherein said first wavelength and said second wavelength differ by greater than 10 nm. ### Claim 12 (depends on 7) The 3D micro display according to claim 7, further comprising: a third single crystal layer, wherein said third single crystal layer is on top of said second single crystal layer, and wherein said third single crystal layer comprises at least ten individual third LED pixels. ### Claim 13 (depends on 7) The 3D micro display according to claim 7, further comprising: a third single crystal layer, wherein said third single crystal layer is on top of said second single crystal layer, and wherein each of said at least one LED driving circuit comprises n type devices and p type devices. ### Claim 14 A 3D micro display, the 3D micro display comprising: a first single crystal layer comprising at least one LED driving circuit; a second single crystal layer comprising a first plurality of light emitting diodes (LEDs), wherein said second single crystal layer comprises at least ten individual first LED pixels; and a second plurality of light emitting diodes (LEDs), wherein said first plurality of light emitting diodes (LEDs) emits a first light with a first wavelength, wherein said second plurality of light emitting diodes (LEDs) emits a second light with a second wavelength, wherein said first wavelength and said second wavelength differ by greater than 10 nm, and wherein said 3D micro display comprises a bonding structure. ### Claim 15 (depends on 14) The 3D micro display according to claim 14, wherein a plurality of said first LED pixels are individually driven, wherein each of said plurality of said first LED pixels is driven by a unique said LED driving circuit. ### Claim 16 (depends on 14) The 3D micro display according to claim 14, wherein said bonding structure comprises an oxide to oxide bond. ### Claim 17 (depends on 14) The 3D micro display according to claim 14, further comprising: a top surface of said first single crystal layer; and a bottom surface of said second single crystal layer, wherein a vertical distance is a distance from said top surface of said first single crystal layer to said bottom surface of said second single crystal layer, and wherein said vertical distance is less than ten microns and greater than 0.1 microns. ### Claim 18 (depends on 14) The 3D micro display according to claim 14, further comprising: a third plurality of light emitting diodes (LEDs), wherein said third plurality of light emitting diodes (LED) emits a third light with a third wavelength, and wherein said first wavelength and said second wavelength and said third wavelength differ by greater than 10 nm from each other. ### Claim 19 (depends on 14) The 3D micro display according to claim 14, further comprising: a third single crystal layer, wherein said third single crystal layer is on top of said second single crystal layer, and wherein said third single crystal layer comprises at least ten third LED pixels. ### Claim 20 (depends on 14) The 3D micro display according to claim 14, wherein said second single crystal layer is on top of said first single crystal layer.