# US 2021/0242269 A1 · Image sensor package

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2021/0242269 A1
- Document ID: US20210242269A1
- Status: Published application
- Kind: A1
- Application number: 17/165,654
- Filed: 2021-02-02
- Published: 2021-08-05
- Earliest claimed: 2020-02-05
- Assignees: Canon Kabushiki Kaisha
- Applicants: Canon Kabushiki Kaisha
- Inventors: Daisuke Toda
- Web page: https://patentgrep.com/patent/US20210242269A1

## CPC

- H10F 39/804: {Containers or encapsulations}
- H10F 39/811: {Interconnections}
- H05K 1/11: Printed elements for providing electric connections to or between printed circuits
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 1/0271: {Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion}
- H05K 1/0298: {Multilayer circuits}
- H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
- H05K 2201/10121: Optical component, e.g. opto-electronic component
- H05K 2201/10151: Sensor
- H05K 2201/10204: Dummy component, dummy PCB or template, e.g. for monitoring, controlling of processes, comparing, scanning
- H05K 2203/1316: Moulded encapsulation of mounted components
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

An image sensor package includes an image sensor, a printed circuit board having a plurality of conductor layers, and a resin molded portion provided so as to surround an outer circumference of the printed circuit board. A first conductor layer among the plurality of conductor layers, which is closest to the resin molded portion has a dummy pattern formed along a circumference inside the resin molded portion.

## Claims

### Claim 1

An image sensor package comprising:
an image sensor;
a printed circuit board having a plurality of conductor layers; and
a resin molded portion provided so as to surround an outer circumference of the printed circuit board,
wherein a first conductor layer among the plurality of conductor layers, which is closest to the resin molded portion has a dummy pattern formed along a circumference inside the resin molded portion.

### Claim 2 (depends on 1)

The image sensor package according to claim 1, wherein the dummy pattern is electrically connected to none of other patterns in the first conductor layer.

### Claim 3 (depends on 1)

The image sensor package according to claim 1, wherein the first conductor layer includes a connector configured to electrically connect part of the dummy pattern and part of the other patterns to each other.

### Claim 4 (depends on 3)

The image sensor package according to claim 3, wherein the connector electrically connects the dummy pattern and a pattern inside the dummy pattern among the other patterns to each other.

### Claim 5 (depends on 3)

The image sensor package according to claim 3, wherein the connector electrically connects the dummy pattern and a pattern outside the dummy pattern among the other patterns to each other.

### Claim 6 (depends on 1)

The image sensor package according to claim 1, wherein the dummy pattern is formed on an entire circumference inside the resin molded portion.

### Claim 7 (depends on 1)

The image sensor package according to claim 1, wherein the dummy pattern is formed on part of the circumference inside the resin molded portion.

### Claim 8 (depends on 1)

The image sensor package according to claim 1, further comprising a solder resist layer configured to cover at least part of the dummy pattern.