# US 2021/0242268 A1 · Photo receiver

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- Number: US 2021/0242268 A1
- Document ID: US20210242268A1
- Status: Published application
- Kind: A1
- Application number: 17/158,537
- Filed: 2021-01-26
- Published: 2021-08-05
- Earliest claimed: 2020-01-30
- Assignees: Sumitomo Electric Industries, Ltd.
- Applicants: Sumitomo Electric Industries, Ltd.
- Inventors: Hideki YAGI; Takuya OKIMOTO; Munetaka KUROKAWA
- Web page: https://patentgrep.com/patent/US20210242268A1

## CPC

- H10F 39/809: {of hybrid image sensors}
- H10F 39/811: {Interconnections}
- H04B 10/615: {Arrangements affecting the optical part of the receiver}
- H10F 39/806: {Optical elements or arrangements associated with the image sensors}
- H10F 39/813: {Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H04B: TRANSMISSION

## Abstract

A photo receiver includes a photo detector including a semiconductor substrate having a first main surface and a second main surface and a metal pattern layer provided on the second main surface; and a carrier including a supporting substrate having a third main surface facing the second main surface and a solder pattern layer provided on the third main surface. The solder pattern layer is bonded to the metal pattern layer. The first main surface is provided with a variable optical attenuator, an optical 90-degree hybrid device, and a plurality of photodiodes optically coupled to the variable optical attenuator via the optical 90-degree hybrid device. The solder pattern layer and the metal pattern layer are located in a peripheral area surrounding a central area where the variable optical attenuator and the optical 90-degree hybrid device are located when viewed in the normal direction of the first main surface.

## Claims

### Claim 1

A photo receiver comprising:
a photo detector including a semiconductor substrate comprising a first main surface and a second main surface opposite to the first main surface, and a metal pattern layer provided on the second main surface; and
a carrier including a supporting substrate comprising a third main surface facing the second main surface, and a solder pattern layer provided on the third main surface, the solder pattern layer being bonded to the metal pattern layer,
the first main surface being provided with a variable optical attenuator, an optical 90-degree hybrid device, and a plurality of photodiodes optically coupled to the variable optical attenuator via the optical 90-degree hybrid device, and
the solder pattern layer and the metal pattern layer being located in a peripheral area surrounding a central area where the variable optical attenuator and the optical 90-degree hybrid device are located when viewed in a normal direction of the first main surface.

### Claim 2 (depends on 1)

The photo receiver according to claim 1, wherein the first main surface is provided with an input port into which a local oscillation light is inputted, the input port being optically coupled to the optical 90-degree hybrid device, and each of the solder pattern layer and the metal pattern layer comprises a portion adjacent to the input port when viewed in the normal direction of the first main surface.

### Claim 3 (depends on 1)

The photo receiver according to claim 1, wherein the variable optical attenuator and the optical 90-degree hybrid device are arranged in a first direction, the solder pattern layer comprises a pair of first portions extending along the first direction and a second portion connecting the pair of the first portions, when viewed in the normal direction of the first main surface, and the metal pattern layer comprises a pair of third portions extending along the first direction and a fourth portion disposed apart from the pair of the third portions, when viewed in the normal direction of the first main surface.

### Claim 4 (depends on 3)

The photo receiver according to claim 3, wherein the second portion extends along a direction intersecting the first direction, when viewed in the normal direction of the first main surface, and the fourth portion extends along a direction intersecting the first direction, when viewed in the normal direction of the first main surface.

### Claim 5 (depends on 3)

The photo receiver according to claim 3, wherein an entire of one of the third portions overlaps with one of the first portions when viewed in the normal direction of the first main surface, wherein an entire of the other of the third portions overlaps with the other of the first portions when viewed in the normal direction of the first main surface, wherein an entire of the fourth portion overlaps with the second portion when viewed in the normal direction of the first main surface.

### Claim 6 (depends on 1)

The photo receiver according to claim 1, wherein the solder pattern layer and the metal pattern layer are not located in the central area when viewed in the normal direction of the first main surface.