# US 2021/0242265 A1 · Image sensors with quantum efficiency enhanced by inverted pyramids

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2021/0242265 A1
- Document ID: US20210242265A1
- Status: Published application
- Kind: A1
- Application number: 16/777,193
- Filed: 2020-01-30
- Published: 2021-08-05
- Earliest claimed: 2020-01-30
- Assignees: OmniVision Technologies, Inc.
- Applicants: OmniVision Technologies, Inc.
- Inventors: Alireza BONAKDAR; Zhiqiang LIN; Bill PHAN; Badrinath PADMANABHAN
- Web page: https://patentgrep.com/patent/US20210242265A1

## CPC

- H10F 39/026: {Wafer-level processing}
- H10F 39/8067: {Reflectors}
- H10F 39/802: {Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes}
- H10F 39/8053: {Colour filters}
- H10F 39/8063: {Microlenses}
- H10F 39/807: {Pixel isolation structures}
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION

## Abstract

An image sensor with quantum efficiency enhanced by inverted pyramids includes a semiconductor substrate and a plurality of microlenses. The semiconductor substrate includes an array of pixels. Each of the pixels is configured to convert light incident on the pixel to an electrical output signal, the semiconductor substrate having a top surface for receiving the light. The top surface forms a plurality of inverted pyramids in each pixel. The plurality of microlenses are disposed above the top surface and aligned to the plurality of inverted pyramids, respectively.

## Claims

### Claim 1

An image sensor with quantum efficiency enhanced by inverted pyramids, comprising:
a semiconductor substrate including an array of pixels, each of the pixels being configured to convert light incident on the pixel to an electrical output signal, the semiconductor substrate having a top surface for receiving the light, the top surface forming a plurality of inverted pyramids in each pixel; and
a plurality of microlenses disposed above the top surface and aligned to the plurality of inverted pyramids, respectively.

### Claim 2 (depends on 1)

The image sensor of claim 1, wherein (i) each of microlenses has a lens surface, and (ii) for each pixel, the lens surfaces of the microlenses disposed over the pixel have no gaps therebetween in dimension orthogonal to optical axes of the microlenses.

### Claim 3 (depends on 1)

The image sensor of claim 1, each of the pixels having a 2×2 or 3×3 array of the inverted pyramids.

### Claim 4 (depends on 1)

The image sensor of claim 1, each of the pixels having a square cross section in a plane orthogonal to optical axes of the microlenses, the square cross section having side length Lp, each of the pixels having exactly N×N of the inverted pyramids, wherein N<Lp/(0.8 microns).

### Claim 5 (depends on 1)

The image sensor of claim 1, apex of each inverted pyramid coinciding with optical axis of a respective one of the microlenses.

### Claim 6 (depends on 1)

The image sensor of claim 1, each microlens being configured such that a focal point for green light is above a base of the inverted pyramid and a focal point for near-infrared light is in the inverted pyramid.

### Claim 7 (depends on 1)

The image sensor of claim 1, each microlens being configured such that a focal point for green light is above a base of the inverted pyramid and a focal point for near-infrared light is within 0.1 microns of the base.

### Claim 8 (depends on 1)

The image sensor of claim 1, further comprising a color filter array disposed between the semiconductor substrate and the microlenses, each color filter of the color filter array covering a respective one of the pixels, the color filter array including (a) a set of near-infrared filters transmissive to near-infrared light, and (b) first, second, and third sets of visible color filters transmissive to respective first, second, and third colors of visible light, wavelength of the second color being shorter than wavelength of the third color and longer than wavelength of the first color.

### Claim 9 (depends on 8)

The image sensor of claim 8, the color filter array forming a planar upper surface supporting the microlenses, each of the microlenses disposed above one of the near-infrared filters having a height, from the planar upper surface, that exceeds height, from the planar upper surface, of each of the microlenses disposed above one of the visible color filters.

### Claim 10 (depends on 9)

The image sensor of claim 9, each of the microlenses disposed above one of the visible color filters in the second set having a height, from the planar upper surface, that (i) exceeds height, from the planar upper surface, of each of the microlenses disposed above one of the visible color filters in the first set and (ii) is exceeded by height, from the planar upper surface, of each of the microlenses disposed above one of the visible color filters in the third set.

### Claim 11 (depends on 8)

The image sensor of claim 8, the color filter array forming a planar upper surface supporting the microlenses, each of the inverted pyramids positioned below one of the near-infrared filters having a depth that exceeds depth of each of the inverted pyramids positioned below one of the visible color filters.

### Claim 12 (depends on 11)

The image sensor of claim 11, each of the inverted pyramids positioned below one of the visible color filters in the second set having a depth that (i) exceeds depth of each of the inverted pyramids positioned below one of the visible color filters in the first set and (ii) is exceeded by depth of each of the inverted pyramids positioned below one of the visible color filters in the third set.

### Claim 13 (depends on 1)

The image sensor of claim 1, each inverted pyramid having four sides arranged along {111} crystal planes of the semiconductor substrate.

### Claim 14 (depends on 1)

The image sensor of claim 1, sides of the inverted pyramids being at an angle, to optical axes of the microlenses, that is between 20 and 60 degrees.

### Claim 15 (depends on 1)

The image sensor of claim 1, each of the microlenses having a first extent transverse to its optical axis, each of the inverted pyramids having a second extent, in dimensions orthogonal to the optical axis of the respective microlens, that is less than the first extent, such that bases of the inverted pyramids are at a planar portion of the top surface.
