# US 2021/0242099 A1 · Electronic device mounting board, electronic package, and electronic module

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- Number: US 2021/0242099 A1
- Document ID: US20210242099A1
- Status: Published application
- Kind: A1
- Application number: 17/050,672
- Filed: 2019-01-31
- Published: 2021-08-05
- Earliest claimed: 2018-04-26
- Assignees: KYOCERA Corporation
- Applicants: KYOCERA Corporation
- Inventors: Fumiaki TAKESHITA; Teruaki NONOYAMA
- Web page: https://patentgrep.com/patent/US20210242099A1

## CPC

- H10W 70/68: Shapes or dispositions thereof
- H10W 70/692: Ceramics or glasses
- H05K 1/111: {Pads for surface mounting, e.g. lay-out}
- H05K 1/182: associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K 1/183: associated with components mounted in and supported by recessed areas of the PCBs
- H05K 1/0298: {Multilayer circuits}
- H05K 1/0306: {Inorganic insulating substrates, e.g. ceramic, glass}
- H05K 1/119: {Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence)}
- H05K 3/3436: {having an array of bottom contacts, e.g. pad grid array or ball grid array components}
- H05K 3/4697: {having cavities, e.g. for mounting components (H05K3/4691 takes precedence)}
- H05K 2201/09036: Recesses or grooves in insulating substrate
- H05K 2203/049: Wire bonding
- H10W 70/611: {for connecting multiple chips together}
- H10W 70/682: {comprising holes having chips therein}
- H10W 70/685: comprising multiple insulating layers
- H10W 70/695: Organic materials
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

A substrate has a first surface and a second surface opposite to the first surface. The substrate has at least one first recess on the first surface and a second recess on the second surface. The substrate includes electrode pads. The electrode pads are in the at least one first recess. The substrate has the at least one first recess located separate from the second recess in a plan view.

## Claims

### Claim 1

An electronic device mounting board, comprising:
a substrate having a first surface and a second surface opposite to the first surface;
at least one first recess located on the first surface and comprising a side wall;
a second recess located on the second surface; and
electrode pads located in the at least one first recess and comprising a side surface, at least a portion of the side surface being apart from the side wall of the at least one first recess,
wherein the electrode pads are located separate from the second recess in a plan view.

### Claim 2 (depends on 1)

The electronic device mounting board according to claim 1, wherein
the at least one first recess is located separate from the second recess in a plan view.

### Claim 3 (depends on 1)

The electronic device mounting board according to claim 1, wherein
the at least one first recess is smaller than the second recess in a plan view.

### Claim 4 (depends on 1)

The electronic device mounting board according to claim 1, wherein
the at least one first recess includes a plurality of first recesses on the first surface.

### Claim 5 (depends on 1)

The electronic device mounting board according to claim 1, wherein
the second recess includes an internal wall.

### Claim 6 (depends on 1)

The electronic device mounting board according to claim 1, wherein
the substrate comprises a ceramic material, and
the at least one first recess has a side wall including a ceramic coating.

### Claim 7 (depends on 1)

The electronic device mounting board according to claim 1, wherein
the at least one first recess is less deep than the second recess.

### Claim 8 (depends on 1)

The electronic device mounting board according to claim 1, wherein
the at least one first recess has a sloped portion in a cross-sectional view.

### Claim 9 (depends on 1)

The electronic device mounting board according to claim 1, wherein
the at least one first recess has a stepped portion in a cross-sectional view.

### Claim 10 (depends on 4)

The electronic device mounting board according to claim 4, wherein
the plurality of first recesses are arranged symmetrically to one another about a center point of the substrate in a plan view.

### Claim 11 (depends on 1)

An electronic package, comprising:
the electronic device mounting board according to claim 1; and
an electronic device mounted on the electronic device mounting board.

### Claim 12 (depends on 1)

An electronic package, comprising:
the electronic device mounting board according to claim 1; and
an electronic device mounted in an area on the first surface of the electronic device mounting board, the area being surrounded by the electrode pads.

### Claim 13 (depends on 11)

An electronic module, comprising:
the electronic package according to claim 11; and
a housing over the electronic package.