# US 2021/0242084 A1 · Substrate processing system and substrate processing method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0242084 A1 - Document ID: US20210242084A1 - Status: Published application - Kind: A1 - Application number: 17/050,490 - Filed: 2019-04-16 - Published: 2021-08-05 - Earliest claimed: 2018-04-27 - Assignees: Tokyo Electron Limited - Applicants: Tokyo Electron Limited - Inventors: Yoshihiro KAWAGUCHI; Hirotoshi MORI; Kazuya HISANO - Web page: https://patentgrep.com/patent/US20210242084A1 ## CPC - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - B23K 26/0006: {taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence)} - B23K 26/20: Bonding (soldering by means of radiant energy B23K1/005) - B23K 26/36: Removing material (B23K26/55, B23K26/57 take precedence) - B23K 26/60: Preliminary treatment - B23K 37/0461: {Welding tables} - B24B 7/04: involving a rotary work-table - H10P 34/40: with high-energy radiation - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - H10P 72/0428: {Apparatus for mechanical treatment or grinding or cutting} - H10P 72/0436: {mainly by radiation} - H10P 72/0606: {Position monitoring, e.g. misposition detection or presence detection} - H10P 72/3402: {Mechanical parts of transfer devices} - H10P 72/3411: {involving loading and unloading of wafers} - H10P 72/53: {using optical controlling means} - H10P 72/7602: {the wafers being placed on a robot blade or gripped by a gripper for conveyance} - H10P 72/7618: {characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel} - B23K 2103/56: {being semiconducting} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract A substrate processing system includes a pre-alignment apparatus having a pre-alignment stage configured to hold a processing target substrate and a detector configured to detect a center position and a crystal orientation of the processing target substrate held by the pre-alignment stage; and a laser processing apparatus having a laser processing stage configured to hold the processing target substrate and a laser processing head configured to radiate and concentrate a laser beam for processing the processing target substrate to the processing target substrate held by the laser processing stage. The pre-alignment apparatus is disposed above the laser processing apparatus. ## Claims ### Claim 1 A substrate processing system, comprising: a pre-alignment apparatus comprising a pre-alignment stage configured to hold a processing target substrate and a detector configured to detect a center position and a crystal orientation of the processing target substrate held by the pre-alignment stage; and a laser processing apparatus comprising a laser processing stage configured to hold the processing target substrate and a laser processing head configured to radiate and concentrate a laser beam for processing the processing target substrate to the processing target substrate held by the laser processing stage, wherein the pre-alignment apparatus is disposed above the laser processing apparatus. ### Claim 2 (depends on 1) The substrate processing system of claim 1, further comprising: a carry-in/out station in which a cassette accommodating therein the processing target substrate is carried in or out; and a thinning apparatus configured to thin the processing target substrate, wherein the thinning apparatus and the carry-in/out station are disposed at opposite sides from each other with the laser processing apparatus therebetween in a horizontal direction. ### Claim 3 (depends on 2) The substrate processing system of claim 2, further comprising: a transfer device configured to be moved between the carry-in/out station and the thinning apparatus while holding the processing target substrate, and deliver the processing target substrate to the carry-in/out station and the thinning apparatus. ### Claim 4 (depends on 3) The substrate processing apparatus of claim 3, wherein the transfer device is equipped with a transfer arm configured to be moved along a guide rail which is provided in a transfer section adjacent to the laser processing apparatus in the horizontal direction. ### Claim 5 (depends on 4) The substrate processing apparatus of claim 4, further comprising: a coating apparatus configured to coat an adhesive on a bonding surface of a support substrate to be bonded with the processing target substrate or on a boding surface of the processing target substrate to be bonded with the support substrate; and a bonding apparatus configured to bond the support substrate and the processing target substrate with the adhesive therebetween, wherein the coating apparatus and the bonding apparatus are disposed adjacent to the transfer section. ### Claim 6 (depends on 4) The substrate processing apparatus of claim 4, further comprising: a control device configured to control a transfer of the processing target substrate from the pre-alignment apparatus to the thinning apparatus by the transfer arm. ### Claim 7 (depends on 1) The substrate processing apparatus of claim 1, further comprising: a transfer arm disposed inside the laser processing apparatus when viewed from a vertical direction, and configured to transfer the processing target substrate from the pre-alignment apparatus to the laser processing apparatus. ### Claim 8 (depends on 1) A substrate processing method of processing a processing target substrate by using a substrate processing system as claimed in claim 1, the substrate processing method comprising: holding the processing target substrate by the pre-alignment stage and detecting, by the detector, the center position and the crystal orientation of the processing target substrate held by the pre-alignment stage; and holding the processing target substrate by the laser processing stage and radiating and concentrating, by the laser processing head, the laser beam for processing the processing target substrate to the processing target substrate held by the laser processing stage. ### Claim 9 (depends on 8) The substrate processing method of claim 8, further comprising: thinning the processing target substrate by a thinning apparatus which is disposed at an opposite side from a carry-in/out station with the laser processing apparatus therebetween in a horizontal direction, the cassette accommodating therein the processing target substrate being carried in or out in the carry-in/out station. ### Claim 10 (depends on 9) The substrate processing method of claim 9, further comprising: transferring the processing target substrate to the carry-in/out station and the thinning apparatus by a transfer device configured to be moved between the carry-in/out station and the thinning apparatus while holding the processing target substrate. ### Claim 11 (depends on 10) The substrate processing method of claim 10, wherein the transfer device comprises a transfer arm configured to be moved along a guide rail which is provided in a transfer section adjacent to the laser processing apparatus in the horizontal direction, wherein the substrate processing method comprises: transferring, by the transfer arm, the processing target substrate to the carry-in/out station and the thinning apparatus. ### Claim 12 (depends on 11) The substrate processing method of claim 11, further comprising: coating, by a coating apparatus disposed adjacent to the transfer section in the horizontal direction, an adhesive on a bonding surface of a support substrate to be bonded with the processing target substrate or on a bonding surface of the processing target substrate to be bonded with the support substrate; and bonding, by a bonding apparatus disposed adjacent to the transfer section in the horizontal direction, the support substrate and the processing target substrate with the adhesive therebetween. ### Claim 13 (depends on 11) The substrate processing method of claim 11, further comprising: transferring, by the transfer arm, the processing target substrate to the thinning apparatus from the pre-alignment apparatus. ### Claim 14 (depends on 8) The substrate processing method of claim 8, further comprising: transferring, by a transfer arm provided inside the laser processing apparatus when viewed from a vertical direction, the processing target substrate to the laser processing apparatus from the pre-alignment apparatus.