# US 2021/0241977 A1 · Structural Lead Frame > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2021/0241977 A1 - Document ID: US20210241977A1 - Status: Published application - Kind: A1 - Application number: 17/148,038 - Filed: 2021-01-13 - Published: 2021-08-05 - Earliest claimed: 2020-02-03 - Assignees: Kemet Electronics Corporation - Applicants: KEMET Electronics Corporation - Inventors: Galen W. Miller; John Bultitude; Lonnie G. Jones - Web page: https://patentgrep.com/patent/US20210241977A1 ## CPC - H01G 4/38: Multiple capacitors, i.e. structural combinations of fixed capacitors - H01G 2/04: specially adapted for mounting on a chassis - H01G 2/06: specially adapted for mounting on a printed-circuit support - H01G 2/08: Cooling arrangements; Heating arrangements; Ventilating arrangements - H01G 2/10: Housing; Encapsulation - H01G 4/224: Housing; Encapsulation - H01G 4/228: Terminals - H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor - H01G 4/30: Stacked capacitors (H01G4/33 takes precedence) - H01G 13/00: Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00 - H05K 1/0204: {using means for thermal conduction connection in the thickness direction of the substrate (H05K1/0207 takes precedence)} - H05K 1/0272: {Adaptations for fluid transport, e.g. channels, holes} - H05K 1/145: {Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules} - H05K 1/18: structurally associated with non-printed electric components (H05K1/16 takes precedence) - H05K 1/181: associated with surface mounted components - H05K 3/328: by welding - H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)} - H01G 4/258: Temperature compensation means - H01G 13/006: {Apparatus or processes for applying terminals} - H05K 1/0259: {Electrostatic discharge [ESD] protection} - H05K 2201/10015: Non-printed capacitor - H05K 2201/10166: Transistor - H05K 2201/10272: Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors - H05K 2201/10424: Frame holders - H05K 2201/10454: Vertically mounted - H05K 2201/10522: Adjacent components - H05K 2201/10537: Attached components - H05K 2201/10545: Related components mounted on both sides of the PCB - H10D 62/8325: {Silicon carbide} - H10D 62/8503: {Nitride Group III-V materials, e.g. AlN or GaN} - H10W 90/00: Package configurations - H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads. ## Claims ### Claim 1 An electronic component package comprising: a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination; a structural lead frame comprising multiple leads wherein each lead of said multiple leads is mounted to at least one said first external termination; and wherein said structural lead frame comprises at least one break away feature between adjacent said leads. ### Claim 2 (depends on 1) The electronic component package of claim 1 wherein at least two said electronic components are electrically connected serially. ### Claim 3 (depends on 1) The electronic component package of claim 1 wherein at least two said electronic components are electrically connected in parallel. ### Claim 4 (depends on 1) The electronic component package of claim 1 wherein each said first external termination comprises an end face and side faces. ### Claim 5 (depends on 4) The electronic component package of claim 4 wherein at least one lead of said multiple leads is connected to said first external termination at said end face or at a side face of said side faces. ### Claim 6 (depends on 1) The electronic component package of claim 1 wherein said structural lead frame comprises at least one lead connector between adjacent said leads. ### Claim 7 (depends on 6) The electronic component package of claim 6 wherein said break away feature is integral to at least one said lead connector. ### Claim 8 (depends on 1) The electronic component package of claim 1 wherein said lead comprises ferrous or non-ferrous material. ### Claim 9 (depends on 1) The electronic component package of claim 1 wherein each said electronic component is independently selected from the group consisting of an MLCC, a resistor, a varistor, a diode, a fuse, an inductor, an overvoltage discharge device, a sensor, a switch, an electrostatic discharge suppressor and an integrated circuit. ### Claim 10 (depends on 1) The electronic component package of claim 1 wherein each said electronic component is an MLCC. ### Claim 11 (depends on 1) The electronic component package of claim 1 wherein at least one said lead of said multiple leads is mounted to said at least one first external termination by a conductive adhesive selected from solders; polymers comprising metals or alloys; and transient liquid phase sintered material. ### Claim 12 (depends on 11) The electronic component package of claim 11 wherein at least one said lead of said multiple leads is mounted to said at least one first external termination by a transient liquid phase sintered material. ### Claim 13 (depends on 1) The electronic component package of claim 1 further comprising an over mold on at least a portion of said structural lead frame. ### Claim 14 (depends on 1) The electronic component package of claim 1 wherein said multiplicity of electronic components are mounted in an orientation selected from vertically oriented and horizontally oriented. ### Claim 15 (depends on 1) The electronic component package of claim 1 further comprising a second structural lead frame comprising multiple second leads wherein each second lead of said second leads is mounted to at least one second external termination. ### Claim 16 (depends on 1) The electronic component package of claim 1 further comprising at least one auxiliary electronic component mounted to said structural lead frame. ### Claim 17 (depends on 16) The electronic component package of claim 16 wherein each said auxiliary electronic component is independently selected from the group consisting of an MLCC, a resistor, a varistor, a diode, a fuse, an inductor, an overvoltage discharge device, a sensor, a switch, an electrostatic discharge suppressor and an integrated circuit. ### Claim 18 (depends on 1) The electronic component package of claim 1 further comprising at least one thermal dissipation element mounted to said structural lead frame. ### Claim 19 (depends on 18) The electronic component package of claim 18 further comprising an electrical insulator between said thermal dissipation element and said structural lead frame. ### Claim 20 (depends on 1) The electronic component package of claim 1 further comprising at least one stabilizer foot attached to said structural lead frame. ### Claim 21 (depends on 1) The electronic component package of claim 1 wherein said structural lead frame comprises an insulative connector between adjacent leads. ### Claim 22 (depends on 1) The electronic component package of claim 1 wherein at least one said lead of said leads is mounted to multiple first external terminations. ### Claim 23 An electrical circuit assembly comprising: an electronic component package comprising: a multiplicity of electronic components wherein each electronic component of said electronic components comprises a first external termination and a second external termination; a structural lead frame comprising multiple leads wherein each lead of said multiple leads is mounted to at least one said first external termination; and wherein said structural lead frame comprises at least one break away feature between adjacent said leads; and a circuit board wherein said circuit board comprises a first trace and a second trace and at least one said lead is in electrical contact with said first trace. ### Claim 24 (depends on 23) The electrical circuit assembly of claim 23 wherein at least two said electronic components are electrically connected serially. ### Claim 25 (depends on 24) The electrical circuit assembly of claim 24 wherein a direction of current flow in said at least two said electronic components is opposite. ### Claim 26 (depends on 23) The electrical circuit assembly of claim 23 wherein at least two said electronic components are electrically connected in parallel. ### Claim 27 (depends on 23) The electrical circuit assembly of claim 23 wherein each said first external termination comprises an end face and side faces. ### Claim 28 (depends on 27) The electrical circuit assembly of claim 27 wherein at least one lead of said multiple leads is connected to said first external termination at said end face or at a side face of said side faces. ### Claim 29 (depends on 23) The electrical circuit assembly of claim 23 wherein said structural lead frame comprises at least one lead connector between adjacent said leads. ### Claim 30 (depends on 29) The electrical circuit assembly of claim 29 wherein said break away feature is integral to at least one said lead connector. ### Claim 31 (depends on 23) The electrical circuit assembly of claim 23 wherein said lead comprises ferrous or non-ferrous material. ### Claim 32 (depends on 23) The electrical circuit assembly of claim 23 wherein each said electronic component is independently selected from the group consisting of an MLCC, a resistor, a varistor, a diode, a fuse, an inductor, an overvoltage discharge device, a sensor, a switch, an electrostatic discharge suppressor and an integrated circuit. ### Claim 33 (depends on 23) The electrical circuit assembly of claim 23 wherein each said electronic component is an MLCC. ### Claim 34 (depends on 23) The electrical circuit assembly of claim 23 wherein at least one said lead of said multiple leads is mounted to said at least one first external termination by a conductive adhesive selected from solders; polymers comprising metals or alloys; and transient liquid phase sintered material. ### Claim 35 (depends on 34) The electrical circuit assembly of claim 34 wherein at least one said lead of said multiple leads is mounted to said at least one first external termination by a transient liquid phase sintered material. ### Claim 36 (depends on 23) The electrical circuit assembly of claim 23 further comprising an over mold on at least a portion of said structural lead frame. ### Claim 37 (depends on 23) The electrical circuit assembly of claim 23 wherein said multiplicity of electronic components are mounted in an orientation selected from vertically oriented and horizontally oriented. ### Claim 38 (depends on 23) The electrical circuit assembly of claim 23 further comprising a second structural lead frame comprising multiple second leads wherein each second lead of said second leads is mounted to at least one second external termination. ### Claim 39 (depends on 23) The electrical circuit assembly of claim 23 further comprising at least one auxiliary electronic component mounted to said structural lead frame. ### Claim 40 (depends on 39) The electrical circuit assembly of claim 39 wherein each said auxiliary electronic component is independently selected from the group consisting of an MLCC, a resistor, a varistor, a diode, a fuse, an inductor, an overvoltage discharge device, a sensor, a switch, an electrostatic discharge suppressor and an integrated circuit. ### Claim 41 (depends on 23) The electrical circuit assembly of claim 23 further comprising at least one thermal dissipation element mounted to said structural lead frame. ### Claim 42 (depends on 41) The electrical circuit assembly of claim 41 further comprising an electrical insulator between said thermal dissipation element and said structural lead frame. ### Claim 43 (depends on 23) The electrical circuit assembly of claim 23 further comprising at least one stabilizer foot attached to said structural lead frame. ### Claim 44 (depends on 43) The electrical circuit assembly of claim 43 wherein said circuit board comprises a mechanical pad and at least one said stabilizer foot is mounted to said mechanical pad. ### Claim 45 (depends on 23) The electrical circuit assembly of claim 23 wherein said structural lead frame comprises an insulative connector between adjacent leads. ### Claim 46 (depends on 23) The electrical circuit assembly of claim 23 wherein at least one said lead of said leads is mounted to multiple first external terminations. ### Claim 47 A method of forming an electrical circuit assembly comprising: forming an electronic component package comprising: arranging a multiplicity of electronic components into an array wherein each electronic component of said electronic components comprises a first external termination and a second external termination; attaching a structural lead frame to said array of electronic components to form an electrical component package wherein said structural lead frame comprises multiple leads wherein each lead of said multiple leads is mounted to at least one said first external termination and wherein said structural lead frame comprises at least one break away feature between adjacent said leads; and attaching said electrical component package to a circuit board wherein said circuit board comprises a first trace and a second trace and at least one said lead is in electrical contact with said first trace. ### Claim 48 (depends on 47) The method of forming an electrical circuit assembly of claim 47 further comprising separating said electrical component package into a first electrical component package and a second electrical component package at said at least one break away feature. ### Claim 49 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein at least two said electronic components are electrically connected serially. ### Claim 50 (depends on 49) The method of forming an electrical circuit assembly of claim 49 wherein a direction of current flow in said at least two said electronic components is opposite. ### Claim 51 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein at least two said electronic components are electrically connected in parallel. ### Claim 52 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein each said first external termination comprises an end face and side faces. ### Claim 53 (depends on 52) The method of forming an electrical circuit assembly of claim 52 further comprising connecting at least one lead of said multiple leads to said first external termination at said end face or at a side face of said side faces. ### Claim 54 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein said structural lead frame comprises at least one lead connector between adjacent said leads. ### Claim 55 (depends on 54) The method of forming an electrical circuit assembly of claim 54 wherein said break away feature is integral to at least one said lead connector. ### Claim 56 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein said lead comprises ferrous or non-ferrous material. ### Claim 57 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein each said electronic component is independently selected from the group consisting of an MLCC, a resistor, a varistor, a diode, a fuse, an inductor, an overvoltage discharge device, a sensor, a switch, an electrostatic discharge suppressor and an integrated circuit. ### Claim 58 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein each said electronic component is an MLCC. ### Claim 59 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein at least one said lead of said multiple leads is mounted to said at least one first external termination by a conductive adhesive selected from solders; polymers comprising metals or alloys; and transient liquid phase sintered material. ### Claim 60 (depends on 59) The method of forming an electrical circuit assembly of claim 59 wherein at least one said lead of said multiple leads is mounted to said at least one first external termination by a transient liquid phase sintered material. ### Claim 61 (depends on 47) The method of forming an electrical circuit assembly of claim 47 further comprising an over mold on at least a portion of said structural lead frame. ### Claim 62 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein said multiplicity of electronic components are mounted in an orientation selected from vertically oriented and horizontally oriented. ### Claim 63 (depends on 47) The method of forming an electrical circuit assembly of claim 47 further comprising a second structural lead frame comprising multiple second leads wherein each second lead of said second leads is mounted to at least one second external termination. ### Claim 64 (depends on 47) The method of forming an electrical circuit assembly of claim 47 further comprising at least one auxiliary electronic component mounted to said structural lead frame. ### Claim 65 (depends on 64) The method of forming an electrical circuit assembly of claim 64 wherein each said auxiliary electronic component is independently selected from the group consisting of an MLCC, a resistor, a varistor, a diode, a fuse, an inductor, an overvoltage discharge device, a sensor, a switch, an electrostatic discharge suppressor and an integrated circuit. ### Claim 66 (depends on 47) The method of forming an electrical circuit assembly of claim 47 further comprising at least one thermal dissipation element mounted to said structural lead frame. ### Claim 67 (depends on 66) The method of forming an electrical circuit assembly of claim 66 further comprising an electrical insulator between said thermal dissipation element and said structural lead frame. ### Claim 68 (depends on 47) The method of forming an electrical circuit assembly of claim 47 further comprising at least one stabilizer foot attached to said structural lead frame. ### Claim 69 (depends on 68) The method of forming an electrical circuit assembly of claim 68 wherein said circuit board comprises a mechanical pad and at least one said stabilizer foot is mounted to said mechanical pad. ### Claim 70 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein said structural lead frame comprises an insulative connector between adjacent leads. ### Claim 71 (depends on 47) The method of forming an electrical circuit assembly of claim 47 wherein at least one said lead of said leads is mounted to multiple first external terminations.