# US 2021/0241976 A1 · Multilayer ceramic electronic component and mount structure for multilayer ceramic electronic component

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- Number: US 2021/0241976 A1
- Document ID: US20210241976A1
- Status: Published application
- Kind: A1
- Application number: 17/126,263
- Filed: 2020-12-18
- Published: 2021-08-05
- Earliest claimed: 2020-01-30
- Assignees: Murata Manufacturing Co., Ltd.
- Applicants: Murata Manufacturing Co., Ltd.
- Inventors: Suguru NAKANO; Risa HOJO; Akira TANAKA; Toru NISHIKAWA; Satoshi MURAMATSU
- Web page: https://patentgrep.com/patent/US20210241976A1

## CPC

- H01G 4/30: Stacked capacitors (H01G4/33 takes precedence)
- H01G 2/065: {for surface mounting, e.g. chip capacitors}
- H01G 4/008: Selection of materials
- H01G 4/012: Form of non-self-supporting electrodes
- H01G 4/1218: {based on titanium oxides or titanates (H01G4/1245 takes precedence)}
- H01G 4/232: electrically connecting two or more layers of a stacked or rolled capacitor
- H01G 11/26: characterised by their structure, e.g. multi-layered, porosity or surface features
- H01G 4/2325: {characterised by the material of the terminals}
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

A multilayer ceramic capacitor has a relationship of about 10°≤θ1≤about 50° and a relationship of about 10°≤θ2≤about 50°, where θ1 denotes an angle between a first end surface and a perpendicular extending from a side of a first main surface at a point of intersection of the first main surface and the first end surface, and θ2 denotes an angle between a second end surface and a perpendicular extending from a side of the first main surface at a point of intersection of the first main surface and the second end surface.

## Claims

### Claim 1

A multilayer ceramic electronic component comprising:
a multilayer body including a stack of a plurality of ceramic layers and including a first main surface and a second main surface facing each other in a height direction, a first side surface and a second side surface facing each other in a width direction orthogonal or substantially orthogonal to the height direction, and a first end surface and a second end surface facing each other in a length direction connecting the first main surface and the second main surface with the first side surface and the second side surface;
a first internal electrode layer on a corresponding one of the plurality of ceramic layers and located inside the multilayer body;
a second internal electrode layer on a corresponding one of the plurality of ceramic layers and located inside the multilayer body;
a first external electrode on the first end surface and on a portion of the second main surface; and
a second external electrode on the second end surface and on a portion of the second main surface; wherein
a relationship B<A is satisfied, where A denotes a length of the multilayer body on the first main surface in the length direction connecting a point of intersection of the first main surface and the first end surface with a point of intersection of the first main surface and the second end surface, and B denotes a length of the multilayer body on the second main surface in the length direction connecting a point of intersection of the second main surface and the first end surface with a point of intersection of the second main surface and the second end surface; and
a relationship of about 10°≤θ1≤about 50° and a relationship of about 10°≤θ2≤about 50° are satisfied, where θ1 denotes an angle between the first end surface and a perpendicular extending from a side of the first main surface at the point of intersection of the first main surface and the first end surface, and θ2 denotes an angle between the second end surface and a perpendicular extending from a side of the first main surface at the point of intersection of the first main surface and the second end surface.

### Claim 2 (depends on 1)

The multilayer ceramic electronic component according to claim 1, wherein a dimension of the multilayer body in the height direction connecting the first main surface with the second main surface is not less than about 27 μm and not greater than about 97 μm.

### Claim 3 (depends on 1)

The multilayer ceramic electronic component according to claim 1, wherein a dimension of the multilayer ceramic electronic component in the height direction connecting the first main surface with the second main surface is not less than about 37 μm and not greater than about 110 μm.

### Claim 4 (depends on 1)

The multilayer ceramic electronic component according to claim 1, wherein the second main surface has an area smaller than an area of the first main surface.

### Claim 5 (depends on 1)

The multilayer ceramic electronic component according to claim 1, wherein
the first external electrode and the second external electrode each include an underlying electrode layer and a plating layer;
the underlying electrode layer includes a metal component and a ceramic component; and
the plating layer includes at least one selected from Cu, Ni, Ag, Pd, Ag—Pd alloy, and Au and includes a plurality of layers.

### Claim 6 (depends on 1)

The multilayer ceramic electronic component according to claim 1, wherein
the first external electrode and the second external electrode each include an underlying electrode layer and a plating layer;
the underlying electrode layer is defined by a thin film electrode and includes at least one selected from the group consisting of Mg, Al, Ti, W, Cr, Cu, Ni, Ag, Co, Mo, and V; and
the plating layer includes at least one selected from Cu, Ni, Ag, Pd, Ag—Pd alloy, and Au and includes a plurality of layers.

### Claim 7 (depends on 6)

The multilayer ceramic electronic component according to claim 6, wherein the plating layer includes a Cu plating layer disposed on the underlying electrode layer, a Ni plating layer disposed on the Cu plating layer, and a Sn plating layer disposed on the Ni plating layer.

### Claim 8 (depends on 6)

The multilayer ceramic electronic component according to claim 6, wherein a plurality of the thin film electrodes are provided.

### Claim 9 (depends on 1)

A mount structure for a multilayer ceramic electronic component according to claim 1, the mount structure comprising:
a circuit board; and
a plurality of signal electrodes disposed on a surface of the circuit board; wherein
the second main surface faces the circuit board, and the plurality of signal electrodes are connected with the first external electrode disposed on a portion of the second main surface and the second external electrode disposed on a portion of the second main surface.

### Claim 10 (depends on 1)

The multilayer ceramic electronic component according to claim 1, wherein a dimension of the multilayer ceramic electronic component in the length direction is not less than about 0.2 mm and not greater than about 1 mm.

### Claim 11 (depends on 1)

The multilayer ceramic electronic component according to claim 1, wherein a dimension of the multilayer ceramic electronic component in the height direction connecting the first main surface with the second main surface is not less than about 40 μm and not greater than about 110 μm.

### Claim 12 (depends on 9)

The mount structure according to claim 9, wherein a dimension of the multilayer body in the height direction connecting the first main surface with the second main surface is not less than about 27 μm and not greater than about 97 μm.

### Claim 13 (depends on 9)

The mount structure according to claim 9, wherein a dimension of the multilayer ceramic electronic component in the height direction connecting the first main surface with the second main surface is not less than about 37 μm and not greater than about 110 μm.

### Claim 14 (depends on 9)

The mount structure according to claim 9, wherein the second main surface has an area smaller than an area of the first main surface.

### Claim 15 (depends on 9)

The mount structure according to claim 9, wherein
the first external electrode and the second external electrode each include an underlying electrode layer and a plating layer;
the underlying electrode layer includes a metal component and a ceramic component; and
the plating layer includes at least one selected from Cu, Ni, Ag, Pd, Ag—Pd alloy, and Au and includes a plurality of layers.

### Claim 16 (depends on 9)

The mount structure according to claim 9, wherein
the first external electrode and the second external electrode each include an underlying electrode layer and a plating layer;
the underlying electrode layer is defined by a thin film electrode and includes at least one selected from the group consisting of Mg, Al, Ti, W, Cr, Cu, Ni, Ag, Co, Mo, and V; and
the plating layer includes at least one selected from Cu, Ni, Ag, Pd, Ag—Pd alloy, and Au and includes a plurality of layers.

### Claim 17 (depends on 16)

The mount structure according to claim 16, wherein the plating layer includes a Cu plating layer disposed on the underlying electrode layer, a Ni plating layer disposed on the Cu plating layer, and a Sn plating layer disposed on the Ni plating layer.

### Claim 18 (depends on 16)

The mount structure according to claim 16, wherein a plurality of the thin film electrodes are provided.

### Claim 19 (depends on 9)

The mount structure according to claim 9, wherein a dimension of the multilayer ceramic electronic component in the length direction is not less than about 0.2 mm and not greater than about 1 mm.

### Claim 20 (depends on 9)

The mount structure according to claim 9, wherein a dimension of the multilayer ceramic electronic component in the height direction connecting the first main surface with the second main surface is not less than about 40 μm and not greater than about 110 μm.