# US 2021/0240617 A1 · System and method for utilizing enhanced thermal telemetry for differential storage of data on a memory module

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- Number: US 2021/0240617 A1
- Document ID: US20210240617A1
- Status: Published application
- Kind: A1
- Application number: 16/778,683
- Filed: 2020-01-31
- Published: 2021-08-05
- Earliest claimed: 2020-01-31
- Assignees: Dell Products L.P.
- Applicants: Dell Products, LP
- Inventors: Balaji Bapu Gururaja Rao; Jordan Chin; Stuart Allen Berke
- Web page: https://patentgrep.com/patent/US20210240617A1

## CPC

- G06F 12/08: in hierarchically structured memory systems, e.g. virtual memory systems
- G01K 1/026: {arrangements for monitoring a plurality of temperatures, e.g. by multiplexing}
- G01K 3/005: {Circuits arrangements for indicating a predetermined temperature (fire detection G08B17/00)}
- G01K 13/00: Thermometers specially adapted for specific purposes
- G06F 2212/1024: Latency reduction
- G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N)
- G01K: MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR (radiation pyrometry G01J5/00)

## Abstract

An information handling system includes first and second memory modules, and a central processing unit. The first memory module includes one or more memory ranks of memory devices, and a first plurality of thermal sensors. The second memory module includes one or more memory ranks of memory devices, and a second plurality of thermal sensors. The central processing unit receives first thermal telemetry data for the first memory module from the first thermal sensors, and second thermal telemetry data for the second memory module from the second thermal sensors. In response to the reception of the first thermal telemetry data, the central processing unit determines a first localized temperature of a first memory rank. In response to the first localized temperature exceeding a threshold temperature, the central processing unit re-maps access of data from the first memory rank to a second memory rank.

## Claims

### Claim 1

An information handling system, comprising:
a first memory module including:
one or more memory ranks of memory devices; and
a first plurality of thermal sensors;
a second memory module including:
one or more memory ranks of memory devices; and
a second plurality of thermal sensors; and
a central processing unit to communicate with the first and second memory modules, the central processing unit to receive first thermal telemetry data for the first memory module from the first thermal sensors, to receive second thermal telemetry data for the second memory module from the second thermal sensors, in response to the reception of the first thermal telemetry data, to determine a first localized temperature of a first memory rank, and in response to the first localized temperature exceeding a threshold temperature, to re-map access of data from the first memory rank to a second memory rank.

### Claim 2 (depends on 1)

The information handling system of claim 1, in response to the reception of the second thermal telemetry data, the central processing unit to determine a second localized temperature of the second memory rank, to determine that the second localized temperature is below the threshold temperature, and to identify the second memory rank as a spare memory rank.

### Claim 3 (depends on 1)

The information handling system of claim 1, further comprising:
a memory controller to communicate with the first memory module and with the central processing unit, the memory controller to receive a control signal from the central processing unit, in response to reception of the control signal, the memory controller to perform the re-map of the access of data from the first memory rank to the second memory rank.

### Claim 4 (depends on 1)

The information handling system of claim 1, further comprising:
a first memory controller to communicate with the first memory module and with the central processing unit; and
a second memory controller to communicate with the second memory module and with the central processing unit,
the processing unit to provide a first control signal to the first memory controller and a second control signal to the second memory controller, wherein the first and second control signals cause the first and second memory controller to perform the re-map of the access of data from the first memory rank within the first memory module to the second memory rank within the second memory module.

### Claim 5 (depends on 1)

The information handling system of claim 1, further comprising:
an electronically erasable programmable read only memory to communicate with the central processing unit; and
a thermal sensor located within the electronically erasable programmable read only memory, the thermal sensor to measure a temperature of the memory module at the electronically erasable programmable read only memory,
the processing unit to determine the first localized temperature based on the temperature of the memory module at the electronically erasable programmable read only memory.

### Claim 6 (depends on 1)

The information handling system of claim 1, further comprising:
a first thermal sensor located in a middle of a first channel of the memory devices, the first thermal sensor to measure a first temperature of the memory module at the first channel; and
a second thermal sensor located in a middle of a second channel of the memory devices, the second thermal sensor to measure a second temperature of the memory module at the second channel,
the processing unit to determine the first localized temperature based on the first and second temperatures.

### Claim 7 (depends on 1)

The information handling system of claim 1, wherein the first memory rank and the second memory rank are both located on the first memory module.

### Claim 8 (depends on 1)

The information handling system of claim 1, wherein the first memory rank is located on the first memory module and the second memory rank is located on the second memory module.

### Claim 9

A method, comprising:
accessing, via a memory controller, data within a first plurality of memory devices of a first memory rank within a first memory module of an information handling system;
receiving, by a central processing unit, thermal telemetry data from a plurality of thermal sensors within the first memory module;
in response to the reception of the thermal telemetry data, determining a first localized temperature of the first memory devices of the first memory rank; and
in response to the first localized temperature exceeding a threshold temperature, re-mapping access of data from the first memory devices of the first memory rank to a second plurality of memory devices of a second memory rank, wherein the second memory rank is a spare memory rank within the information handling system.

### Claim 10 (depends on 9)

The method of claim 9, wherein the re-mapping of the data from the first memory devices of the first memory rank to the second plurality of memory devices of the second memory rank further comprises:
receiving, by the memory controller, a control signal from the central processing unit; and
in response to the receiving of the control signal, re-mapping, by the memory controller, the access of data from the first memory rank to the second memory rank.

### Claim 11 (depends on 9)

The method of claim 9, wherein the re-mapping of the access of data from the first memory rank to the second memory rank further comprises:
providing a first control signal to a first memory controller;
providing a second control signal to a second memory controller; and
in response to the first and second control signals, performing, by the first and second memory controller, the re-mapping of the access of data from the first memory rank to the second memory rank.

### Claim 12 (depends on 11)

The method of claim 11, wherein the first memory rank is located on the first memory module and the second memory rank is located on the second memory module.

### Claim 13 (depends on 9)

The method of claim 9, further comprising:
receiving, by the central processing unit and from a thermal sensor located within an electronically erasable programmable read only memory of the memory module, a temperature of the memory module at the electronically erasable programmable read only memory; and
determining, by the central processing unit and based on the temperature of the memory module at the electronically erasable programmable read only memory, a localized temperature of the memory module.

### Claim 14 (depends on 9)

The method of claim 9, further comprising:
receiving, by the central processing unit from a first thermal sensor located in a middle of a first channel of the memory devices, a first temperature of the memory module at the first channel of the memory module;
receiving, by the central processing unit from a second thermal sensor located in a middle of a second channel of the memory devices, a second temperature of the memory module at the second channel of the memory module; and
determining, by the central processing unit and based on the first and second temperatures, different localized temperatures of the memory module.

### Claim 15 (depends on 9)

The method of claim 9, further comprising:
receiving, by the central processing unit, a second localized temperature of the second memory rank;
determining that the second localized temperature is below the threshold temperature; and
identifying the second memory rank as the spare memory rank.

### Claim 16 (depends on 9)

The method of claim 9, wherein the first memory rank and the second memory rank are both located on the first memory module.

### Claim 17

An information handling system, comprising:
a first memory module including:
one or more memory ranks of memory devices; and
a first plurality of thermal sensors;
a second memory module including:
one or more memory ranks of memory devices; and
a second plurality of thermal sensors; and
a memory controller to communicate with the first and second memory modules, the central processing unit to receive first thermal telemetry data for the first memory module from the first thermal sensors, to receive second thermal telemetry data for the second memory module from the second thermal sensors, in response to the reception of the first thermal telemetry data, to determine a first localized temperature of a first memory rank, and in response to the first localized temperature exceeding a threshold temperature, to re-map access of data from the first memory rank to a second memory rank.

### Claim 18 (depends on 17)

The information handling system of claim 17, further comprising:
a first thermal sensor located in a middle of a first channel of the memory devices, the first thermal sensor to measure a first temperature of the memory module at the first channel; and
a second thermal sensor located in a middle of a second channel of the memory devices, the second thermal sensor to measure a second temperature of the memory module at the second channel,
the memory controller to determine the first localized temperature based on the first and second temperatures.

### Claim 19 (depends on 17)

The information handling system of claim 17, wherein the first memory rank and the second memory rank are both located on the first memory module.

### Claim 20 (depends on 17)

The information handling system of claim 17, wherein the first memory rank is located on the first memory module and the second memory rank is located on the second memory module.