# US 2021/0240075 A1 · Stamp and method for embossing

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2021/0240075 A1
- Document ID: US20210240075A1
- Status: Published application
- Kind: A1
- Application number: 17/051,312
- Filed: 2018-05-04
- Published: 2021-08-05
- Earliest claimed: 2018-05-04
- Assignees: EV Group E. Thallner GmbH
- Applicants: EV Group E. Thallner GmbH
- Inventors: Markus WIMPLINGER; Gerald MITTENDORFER
- Web page: https://patentgrep.com/patent/US20210240075A1

## CPC

- G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping}
- B29C 59/002: {Component parts, details or accessories; Auxiliary operations}
- B29C 59/022: {characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor}
- B29C 59/026: {of layered or coated substantially flat surfaces}
- G03F 7/70875: {Temperature, e.g. temperature control of masks or workpieces via control of stage temperature}
- B29C 2059/023: {Microembossing}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)

## Abstract

A stamp comprised of a soft stamp and a carrier fixed to the soft stamp.

## Claims

### Claim 1

A stamp comprising:
a soft stamp; and
a bendable carrier fixed on the soft stamp, wherein the carrier comprises at least one heating element and the soft stamp is fixed detachably to the carrier.

### Claim 2

(canceled)

### Claim 3 (depends on 1)

The stamp according to claim 1, wherein the stamp further comprises a temperature-controlled carrier holder.

### Claim 4 (depends on 1)

The stamp according to claim 1, wherein the at least one heating element is constituted as a meandering, strip conductor.

### Claim 5 (depends on 1)

The stamp according to claim 1, wherein the at least one heating element is constituted as a coil.

### Claim 6 (depends on 1)

The stamp according to claim 1, wherein the soft stamp comprises conductive nanoparticles.

### Claim 7 (depends on 1)

The stamp according to claim 1, wherein the at least one heating element is constituted as a conductive layer in and/or on the carrier.

### Claim 8 (depends on 1)

The stamp according to claim 1, wherein there can be generated in the carrier a current density between 0.01 A/m2 and 1 MA/m2.

### Claim 9 (depends on 1)

The stamp according to claim 1, wherein the carrier is constituted as a plate, wherein the thickness of the plate is between 0.01 mm and 20 mm.

### Claim 10 (depends on 1)

The stamp according to claim 1, wherein the carrier is constituted as a film.

### Claim 11

A device comprising:
a stamp comprising:
a soft stamp, and
a bendable carrier fixed on the soft stamp, wherein the carrier comprises at least one heating element and the soft stamp is fixed detachably to the carrier; and
a control unit for controlling the at least one heating element.

### Claim 12 (depends on 1)

Use of a stamp according to claim 1 for embossing an embossing compound.

### Claim 13

A method for embossing an embossing compound with a stamp comprising a soft stamp and a bendable carrier fixed on the soft stamp, wherein the carrier comprises at least one heating element and the soft stamp is fixed detachably to the carrier, said method comprising:
coating a substrate with the embossing compound, aligning the stamp relative to the substrate, embossing the embossing compound by use of the stamp,
heating the embossing compound by use of the at least one heating element of the carrier,
removing the stamp from the embossing compound.

### Claim 14 (depends on 4)

The stamp according to claim 4, wherein said meandering, strip conductor is a metallic and/or n-doped region.

### Claim 15 (depends on 5)

The stamp according to claim 5, wherein said coil is a flat coil.

### Claim 16 (depends on 7)

The stamp according to claim 7, wherein the carrier is at least partially comprised of a conductive material.

### Claim 17 (depends on 16)

The stamp according to claim 16, wherein the conductive material is metal.

### Claim 18 (depends on 10)

The stamp according to claim 10, wherein said film is comprised of an organic semiconductor.

### Claim 19 (depends on 10)

The stamp according to claim 10, wherein said film has a thickness between 0.01 mm and 5 mm.

### Claim 20 (depends on 11)

The device according to claim 11, wherein the control unit is a current and/or voltage source