# US 2021/0240070 A1 · Pellicle for euv lithography

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- Number: US 2021/0240070 A1
- Document ID: US20210240070A1
- Status: Published application
- Kind: A1
- Application number: 17/048,875
- Filed: 2019-04-12
- Published: 2021-08-05
- Earliest claimed: 2018-05-04
- Assignees: ASML Netherlands B.V.
- Applicants: Asml Netherlands B.V.
- Inventors: Dennis DE GRAAF; Richard BEAUDRY; Maxime BIRON; Paul JANSSEN; Thijs KATER; Kevin KORNELSEN; Michael Alfred Josephus KUIJKEN; Jan Hendrik Willem KUNTZEL; Stephane MARTEL; Maxim Aleksandrovich NASALEVICH; Guido SALMASO; Pieter-Jan VAN ZWOL
- Web page: https://patentgrep.com/patent/US20210240070A1

## CPC

- G03F 1/64: characterised by the frames, e.g. structure or material, including bonding means therefor
- G03F 1/62: Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
- G03F 7/70983: {Optical system protection, e.g. pellicles or removable covers for protection of mask}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

A wafer including a mask on one face and at least one layer on an opposite face, wherein the mask has at least one scribeline which overlies at least a portion of the opposite face which is substantially free of the at least one layer is described. Also described is a method of preparing a pellicle, the method including: providing a wafer having a mask on one face and at least one layer on an opposite face, defining a scribeline in the mask, and selectively removing a portion of the at least one layer which at least partially overlies the scribeline as well as a method of preparing a pellicle, the method including: providing a pellicle core, and removing at least some material from at least one face of the pellicle core in a non-oxidising environment. In any aspect, the pellicle may include a metal nitride layer.

## Claims

### Claim 1

An assembly, comprising a wafer, a mask provided on one face of the wafer, and at least one layer provided on an opposite face of the wafer to the one face, wherein the mask comprises at least one scribeline which overlies at least a portion of the opposite face which is substantially free of the at least one layer.

### Claim 2 (depends on 1)

The assembly according to claim 1, wherein the wafer comprises silicon, and/or the mask comprises a positive or negative resist and/or the at least one layer comprises one or more selected from: a membrane, a sacrificial layer, and/or a pellicle layer.

### Claim at position 3

-5. (canceled)

### Claim 6 (depends on 1)

The assembly according to claim 1, wherein the wafer further comprises a protective layer, and wherein the at least one layer is arranged between the protective layer and the wafer.

### Claim 7

(canceled)

### Claim 8 (depends on 6)

The assembly according to claim 6, wherein the protective layer has a projecting part extending into a gap formed in the at least one layer at the portion of the opposite face which is substantially free of the at least one layer.

### Claim 9 (depends on 6)

The assembly according to claim 6, wherein the protective layer comprises at least one selected from: a polymer, a resist, and/or a lacquer.

### Claim 10

A method of preparing a pellicle, the method comprising:
providing an assembly comprising a wafer, a mask provided on one face of the wafer, and at least one layer provided on an opposite face of the wafer to the one face,
defining a scribeline in the mask, and
selectively removing a portion of the at least one layer which at least partially overlies the scribeline.

### Claim 11

(canceled)

### Claim 12 (depends on 10)

The method according to claim 10, further comprising providing a protective layer over at least a portion of the at least one layer such that the at least a portion of the at least one layer is arranged between the protective layer and the mask.

### Claim 13 (depends on 12)

The method according to claim 12, wherein the protective layer is provided with a projecting part extending into a gap formed by the selectively removed portion of the at least one layer.

### Claim 14 (depends on 10)

The method according to claim 10, further comprising etching at least a portion of the wafer and/or removing at least a portion of a protective layer.

### Claim 15

(canceled)

### Claim 16 (depends on 10)

The method according to claim 10, wherein the scribeline and/or the mask is defined by lithography, and/or wherein the at least one layer comprises one or more selected from: a membrane, a sacrificial layer, and/or a pellicle layer, and/or wherein the wafer has a protective layer comprising at least one selected from: a polymer, a resist, and/or a lacquer.

### Claim at position 15

-20. (canceled)

### Claim 21

A method of preparing a pellicle, the method comprising:
providing a pellicle core, and
removing at least some material from at least one face of the pellicle core in a non-oxidising environment.

### Claim 22 (depends on 21)

The method according to claim 21, further comprising depositing a capping layer on at least one face of the pellicle.

### Claim at position 18

-25. (canceled)

### Claim 26 (depends on 22)

The method according to claim 22, wherein the capping layer is deposited under vacuum and/or wherein the non-oxidising environment is a vacuum.

### Claim 27

(canceled)

### Claim 28

A pellicle for a lithographic apparatus, the pellicle comprising a silicon core and one or more capping layers, wherein the pellicle is substantially devoid of an oxide layer between the silicon core and the one or more capping layers.

### Claim 29 (depends on 1)

A pellicle for a lithographic apparatus manufactured from or comprising the assembly according to claim 1.

### Claim 30

(canceled)

### Claim 31

A pellicle for a lithographic apparatus, the pellicle comprising at least one metal nitride layer and a metallic capping layer disposed on the at least one metal nitride layer.

### Claim 32

(canceled)

### Claim 33 (depends on 31)

The pellicle according to claim 31, wherein the at least one metal nitride layer comprises ruthenium, molybdenum, boron, zirconium, titanium, tantalum, or a combination selected therefrom.

### Claim 34 (depends on 31)

The pellicle according to claim 31, wherein the metallic capping layer comprises ruthenium, molybdenum, boron, zirconium, titanium, tantalum, or a combination selected therefrom.

### Claim 35 (depends on 31)

The pellicle according to claim 31, further comprising a pellicle frame of silicon, wherein the metal nitride layer is arranged between the frame and the metallic capping layer, and wherein the metal nitride layer is provided on the frame substantially devoid of an oxide layer between the frame and the metal nitride layer.

### Claim 36 (depends on 31)

The pellicle according to claim 31, wherein the metallic capping layer comprises ruthenium, and wherein the metal nitride layer comprises, or is made of, titanium nitride and/or tantalum nitride.