# US 2021/0240040 A1 · Backlight module

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- Number: US 2021/0240040 A1
- Document ID: US20210240040A1
- Status: Published application
- Kind: A1
- Application number: 17/257,834
- Filed: 2019-12-17
- Published: 2021-08-05
- Earliest claimed: 2018-12-18
- Assignees: Shenzhen Tcl New Technology Co., Ltd.
- Applicants: Shenzhen Tcl New Technology Co., Ltd.
- Inventors: Zelong LI; Daiqing WANG; Kewen Qiang; Honglei JI
- Web page: https://patentgrep.com/patent/US20210240040A1

## CPC

- G02F 1/133603: {with LEDs}
- G02F 1/133605: {including specially adapted reflectors}
- G02F 1/133607: {the light controlling member including light directing or refracting elements, e.g. prisms or lenses}
- G02F 1/133612: {Electrical details}
- G02F 1/133614: {using photoluminescence, e.g. phosphors illuminated by UV or blue light}
- H10H 20/8513: {having two or more wavelength conversion materials}
- H10H 20/853: characterised by their shape
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/882: {Scattering means (H10H20/82 takes precedence)}
- H10H 29/24: comprising multiple light-emitting semiconductor devices
- H10W 90/00: Package configurations
- G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A backlight module. The backlight module comprises: an LED chip (1), a transparent support (2), and a packaging adhesive (3); an accommodating groove (21) is provided on the transparent support (2), and the LED chip (1) is provided at the bottom of the accommodating groove (21); the packaging adhesive (3) is located in the accommodating groove (21) and covers a light-exiting surface of the LED chip (1). The LED chip (1) and the packaging adhesive (3) are provided in the accommodating groove (21), so that the transparent support (2) and the packaging adhesive (3) enlarge a light-exiting angle of the LED chip (1), thereby reducing the number of the LED chips (1) in the backlight module and reducing the production costs.

## Claims

### Claim 1

A backlight module, comprising an LED chip, wherein further comprising a plurality of transparent brackets and a plurality of sealant, the transparent bracket has an accommodation groove arranged, the LED chip is arranged at a bottom of the accommodation groove, the sealant is arranged in the accommodation groove, and covers a light-emitting surface of the LED chip.

### Claim 2 (depends on 1)

The backlight module according to claim 1, wherein a surface of the sealant facing to an opening of the accommodation groove is an arc-shaped surface, and the arc-shaped surface is recessed toward the LED chip.

### Claim 3 (depends on 1)

The backlight module according to claim 1, wherein the accommodation groove is a truncated cone-shaped accommodation groove, and a diameter of a bottom of the truncated cone-shaped accommodation groove is smaller than a diameter of the opening thereof

### Claim 4 (depends on 1)

The backlight module according to claim 1, wherein the sealant has a plurality of light diffusion particles arranged inside.

### Claim 5 (depends on 1)

The backlight module according to claim 1, wherein the accommodation groove further has a reflector arranged inside, and the reflector locates on the surface of the sealant facing to the opening of the accommodation groove.

### Claim 6 (depends on 5)

The backlight module according to claim 5, wherein the reflector is made of a mixed material comprising TiO2, SiO2 and silica gel.

### Claim 7 (depends on 5)

The backlight module according to claim 5, wherein a side of the reflector facing to the opening of the accommodation groove is a flat surface.

### Claim 8 (depends on 7)

The backlight module according to claim 7, wherein the side of the reflector facing to the opening of the accommodation groove is coplanar with a surface of the transparent bracket.

### Claim 9 (depends on 5)

The backlight module according to claim 5, wherein the side of the reflector facing to the opening of the accommodation groove is an arc-shaped surface, recessing toward the bottom of the accommodation groove.

### Claim 10 (depends on 5)

The backlight module according to claim 5, wherein the side of the reflector facing to the opening of the accommodation groove is an arc-shaped surface, protruding toward the opening of the accommodation groove.

### Claim 11 (depends on 1)

The backlight module according to claim 1, wherein further comprising a PCB board, the transparent brackets are arranged on the PCB board, the LED chip electrically connects to the PCB board, and a side of the PCB board having the transparent brackets mounted on has further a reflective layer arranged.

### Claim 12 (depends on 11)

The backlight module according to claim 11, wherein a side of the transparent bracket away from the PCB board has a diffusion plate and a quantum dot membrane sequentially arranged.

### Claim 13 (depends on 12)

The backlight module according to claim 12, wherein the quantum dot membrane is made of a red quantum dot material and a green quantum dot material.

### Claim 14 (depends on 13)

The backlight module according to claim 13, wherein both the red quantum dot material and the green quantum dot material are selected from the group consisting of a III-V group compound, a II-VI group compound, an all-inorganic cesium lead halide perovskite quantum dot and an organic-inorganic hybrid perovskite material.

### Claim 15 (depends on 12)

The backlight module according to claim 12, wherein a side of the quantum dot membrane away from the PCB board has a composite membrane arranged, the composite membrane comprises at least one of a diffusing piece, a brightening sheet and a MicroLENS.