# US 2021/0239754 A1 · Method and apparatus comprising a semiconductor device and test apparatus

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- Number: US 2021/0239754 A1
- Document ID: US20210239754A1
- Status: Published application
- Kind: A1
- Application number: 17/118,828
- Filed: 2020-12-11
- Published: 2021-08-05
- Earliest claimed: 2020-01-31
- Assignees: NXP B.V.
- Applicants: NXP B.V.
- Inventors: Jan-Peter Schat; Abdellatif Zanati; Henrik Asendorf; Maristella Spella; Waqas Hassan Syed; Giorgio Carluccio; Antonius Johannes Matheus de Graauw
- Web page: https://patentgrep.com/patent/US20210239754A1

## CPC

- G01R 31/311: of integrated circuits {(G01R31/31728 takes precedence)}
- H01Q 3/267: {Phased-array testing or checking devices}
- G01R 1/045: {Sockets or component fixtures for RF or HF testing}
- G01R 31/2822: {of microwave or radiofrequency circuits (of attenuation, gain, e.g. using network analyzers G01R27/28)}
- G01S 7/028: {Miniaturisation, e.g. surface mounted device [SMD] packaging or housings}
- G01S 7/4017: {of HF systems}
- G01S 7/4082: {using externally generated reference signals, e.g. via remote reflector or transponder}
- H04B 17/14: of the whole transmission and reception path, e.g. self-test loop-back
- H10W 44/20: at high-frequency [HF] or radio frequency [RF]
- G01S 13/931: of land vehicles
- H10W 44/216: {Waveguides, e.g. strip lines}
- H10W 44/248: {for antennas}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)
- H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72)
- G01S: RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- H04B: TRANSMISSION
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A method of testing a semiconductor device. An apparatus comprising a semiconductor device and a test apparatus. The semiconductor device includes an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements include transmit elements and receive elements. The test apparatus includes a surface for placing against the surface of the device. The test apparatus also includes at least one waveguide, which extends through the test apparatus for routing electromagnetic radiation transmitted by one of the transmit elements of the device to one of the receive elements of the device. Each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device. A spacing between the waveguide openings of each waveguide is larger than, or smaller than a spacing between the corresponding radiating elements.

## Claims

### Claim 1

An apparatus comprising:
a semiconductor device comprising an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements including at least one transmit element and at least one receive element; and
a test apparatus for testing the semiconductor device, the test apparatus comprising:
a surface for placing against said surface of the device; and
at least one waveguide, wherein each waveguide extends through the test apparatus for routing electromagnetic radiation transmitted by one of said transmit elements of the device to one of the receive elements of the device, wherein each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device,
wherein a spacing between the waveguide openings of each waveguide of the test apparatus is larger than, or smaller than a spacing between the corresponding radiating elements of the device.

### Claim 2 (depends on 1)

The apparatus of claim 1, wherein a spacing between the waveguide openings of each waveguide of the test apparatus is larger than, or smaller, than a spacing between the corresponding radiating elements of the device by at least 0.1%.

### Claim 3 (depends on 2)

The apparatus of claim 2, wherein a spacing between the waveguide openings of each waveguide of the test apparatus is larger than, or smaller than, a spacing between the corresponding radiating elements of the device by at least 1%.

### Claim 4 (depends on 1)

The apparatus of claim 1, wherein the spacing between the waveguide openings of each waveguide of the test apparatus is smaller than the spacing between the corresponding radiating elements of the device.

### Claim 5 (depends on 1)

The apparatus of claim 1, wherein the spacing between the waveguide openings of each waveguide of the test apparatus is larger than the spacing between the corresponding radiating elements of the device.

### Claim 6 (depends on 1)

The apparatus of claim 1, wherein at least one of the waveguides is configured to route electromagnetic radiation transmitted by one of said transmit elements of the device to a plurality of receive elements of the device.

### Claim 7 (depends on 6)

The apparatus of claim 6, wherein said waveguide comprises:
a first branch for conveying electromagnetic radiation transmitted by said transmit element; and
at least two further branches coupled to the first branch for route said electromagnetic radiation to said plurality of receive element.

### Claim 8 (depends on 1)

The apparatus of claim 1, wherein the semiconductor device comprises a semiconductor die located in a package, and wherein the surface of the device at which the plurality of external radiating elements are located is an external surface of the package.

### Claim 9 (depends on 1)

The apparatus of claim 1, wherein the semiconductor device comprises:
a semiconductor die located in a package; and
a carrier, wherein the package is mounted on a carrier,
wherein the surface of the device at which the plurality of external radiating elements are located is a surface of the carrier.

### Claim 10

A method of testing a semiconductor device, the method comprising:
providing a semiconductor device comprising an integrated circuit and a plurality of external radiating elements at a surface of the device, the radiating elements including at least one transmit element and at least one receive element;
providing a test apparatus for testing the semiconductor device, the test apparatus comprising:
a surface for placing against said surface of the device; and
at least one waveguide, wherein each waveguide extends through the test apparatus for routing electromagnetic radiation transmitted by one of said transmit elements of the device to one of the receive elements of the device,
wherein each waveguide comprises a plurality of waveguide openings for coupling electromagnetically to corresponding radiating elements of the plurality of radiating elements located at the surface of the device,
wherein a spacing between the waveguide openings of each waveguide of the test apparatus is larger than, or smaller than a spacing between the corresponding radiating elements of the device, and
transmitting electromagnetic radiation from at least one said transmit element to at least one said receive element via at least one waveguide of the test apparatus.

### Claim 11 (depends on 10)

The method of claim 10, wherein a spacing between the waveguide openings of each waveguide of the test apparatus is larger than, or smaller than, a spacing between the corresponding radiating elements of the device by at least 0.1%.

### Claim 12 (depends on 11)

The method of claim 11, wherein a spacing between the waveguide openings of each waveguide of the test apparatus is larger than, or smaller than, a spacing between the corresponding radiating elements of the device by at least 1%.

### Claim 13 (depends on 10)

The method of claim 10, wherein the spacing between the waveguide openings of each waveguide of the test apparatus is smaller than the spacing between the corresponding radiating elements of the device.

### Claim 14 (depends on 10)

The method of claim 10, wherein the spacing between the waveguide openings of each waveguide of the test apparatus is larger than the spacing between the corresponding radiating elements of the device.

### Claim 15 (depends on 10)

The method of claim 10, wherein said transmitting electromagnetic radiation from at least one said transmit element to at least one said receive element via at least one waveguide of the test apparatus comprises at least one of the waveguides routing electromagnetic radiation transmitted by one of said transmit elements of the device to a plurality of receive elements of the device.

### Claim 16 (depends on 10)

The method of claim 10, wherein the test apparatus further comprises a dielectric portion forming said surface for placing against said surface of the device, wherein the dielectric portion provides a matched interface for said electromagnetic coupling of the plurality of waveguide openings to the plurality of radiating elements of the device.

### Claim 17 (depends on 1)

The apparatus of claim 1, wherein the test apparatus further comprises a dielectric portion forming said surface for placing against said surface of the device, wherein the dielectric portion is configured to provide a matched interface for said electromagnetic coupling of the plurality of waveguide openings to the plurality of radiating elements of the device.

### Claim 18 (depends on 17)

The apparatus of claim 17, wherein the dielectric portion has a thickness, measured between the plurality of radiating elements located at a surface of the device and the plurality of waveguide openings, which is substantially equal to 212, where λ is a wavelength of said electromagnetic radiation in the dielectric portion.

### Claim 19 (depends on 17)

The apparatus of claim 17, wherein the dielectric portion comprises a curved surface for coupling electromagnetic radiation transmitted by a plurality of transmit elements of the device to an opening of said plurality of waveguide openings.

### Claim 20 (depends on 1)

The apparatus of claim 1, further comprising an attenuating portion located in at least one of said waveguides.